EP1S40F1508C6

The EP1S40F1508C6 is a Stratix® Field Programmable Gate Array (FPGA) from Altera in a 1508-BBGA/FCBGA package. It delivers substantial on-chip logic and memory capacity alongside a high I/O count for commercial-grade embedded designs.

With 41,250 logic elements and approximately 3.42 Mbits of embedded memory, the device targets applications that require dense logic integration, significant on-chip RAM, and broad external connectivity while operating within a 0 °C to 85 °C commercial temperature range and a core supply of 1.425 V to 1.575 V.

Key Features

• Logic Capacity — 41,250 logic elements provide significant programmable fabric for complex logic, signal processing, and control functions.
• Embedded Memory — Approximately 3.42 Mbits of total on-chip RAM bits to support buffers, FIFOs, and intermediate storage without requiring external memory for many use cases.
• High I/O Count — 822 I/O pins enable broad interfacing to peripherals, custom bus implementations, and board-level connectivity.
• Package — 1508-FBGA (40x40) FCBGA package suitable for high-density board designs where compact ball-grid packaging is required.
• Power — Core supply voltage range of 1.425 V to 1.575 V for precise power planning and regulator selection.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for mainstream electronics and embedded applications.
• Compliance — RoHS compliant to support environmentally conscious manufacturing and procurement requirements.

Typical Applications

• High-density I/O control — Use the 822 I/O pins for complex peripheral interfacing, multi-channel control, and custom board-level communication fabrics.
• Logic-intensive processing — Leverage 41,250 logic elements for custom datapath implementations, protocol aggregation, and state-machine heavy designs.
• On-chip buffering and data staging — Approximately 3.42 Mbits of embedded memory supports FIFOs, packet buffering, and intermediate data storage to reduce external memory reliance.

Unique Advantages

• High integration in a compact package: Large logic and memory capacity in a 1508-FBGA (40x40) package reduces board area and simplifies high-density designs.
• Extensive external connectivity: 822 I/O pins provide flexibility for multi-interface, multi-peripheral, and high-channel-count systems.
• Embedded memory to reduce BOM: Approximately 3.42 Mbits of on-chip RAM can lower the need for external memory components, simplifying BOM and layout.
• Defined power envelope: Specified core voltage range (1.425 V–1.575 V) enables predictable power supply selection and thermal planning.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation for mainstream embedded and consumer-facing applications.
• RoHS compliant: Supports environmentally responsible manufacturing and regulatory requirements.

Why Choose EP1S40F1508C6?

The EP1S40F1508C6 balances significant programmable logic capacity, substantial embedded memory, and a very large I/O count in a compact FCBGA package. It is positioned for designers who need dense logic resources and broad connectivity within a defined commercial operating range and core voltage envelope.

This device is a practical choice for teams developing mid- to high-complexity embedded systems that benefit from on-chip memory and extensive I/O while maintaining RoHS compliance and predictable power and thermal requirements.

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