EP1S40F1508C7
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 822 3423744 41250 1508-BBGA, FCBGA |
|---|---|
| Quantity | 1,980 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 822 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 41250 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3423744 |
Overview of EP1S40F1508C7 – Stratix® Field Programmable Gate Array (FPGA), 1508-BBGA
The EP1S40F1508C7 is a Stratix® FPGA from Altera in a 1508-BBGA (FCBGA) package, offering a combination of high logic capacity, substantial embedded memory, and a large I/O complement for complex digital designs. It is a commercial-grade, surface-mount FPGA that supports a 1.425 V to 1.575 V core supply and is specified for 0 °C to 85 °C operation.
With 41,250 logic elements and approximately 3.4 Mbits of on-chip RAM, this device targets applications that require significant programmable logic, memory resources, and dense external connectivity in a compact FCBGA footprint.
Key Features
- Core Logic 41,250 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
- Embedded Memory Approximately 3.4 Mbits of on-chip RAM to support buffering, state storage, and local data processing without relying on external memory.
- I/O Capacity Up to 822 I/O pins to accommodate high-density external interfaces and multi-channel connectivity.
- Package and Mounting 1508-BBGA (FCBGA) package, supplier device package 1508-FBGA (40×40), designed for surface-mount assembly to save board area.
- Power Core voltage supply range of 1.425 V to 1.575 V for defined power domain requirements.
- Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Compliance RoHS-compliant construction for environmental compatibility in regulated assemblies.
Typical Applications
- High-density interface bridging Use the 822 I/O pins and large logic capacity to implement custom protocol translation and multi-interface bridging between peripherals and system buses.
- Data buffering and pre-processing Leverage approximately 3.4 Mbits of embedded memory for on-chip buffering and local data manipulation ahead of external processing stages.
- Custom control and state machines Deploy the 41,250 logic elements to implement complex control algorithms, sequencers, and finite-state machines for system-level control.
Unique Advantages
- High integration Combines a large logic fabric and substantial on-chip RAM to reduce the need for external discrete logic and memory.
- Extensive external connectivity 822 I/O pins support multiple parallel interfaces, sensors, and peripheral channels without extensive multiplexing.
- Compact FCBGA footprint The 1508-BBGA (40×40) supplier package enables dense board integration while retaining high pin count.
- Defined power envelope A clear core supply range (1.425 V–1.575 V) simplifies power-supply design and verification.
- Commercial-grade specification Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic systems.
- RoHS compliant Built to meet environmental compliance requirements for regulated markets.
Why Choose EP1S40F1508C7?
The EP1S40F1508C7 positions itself as a high-capacity, commercially rated FPGA option that balances programmable logic, embedded memory, and a large I/O count within a compact FCBGA package. Its specification set—41,250 logic elements, approximately 3.4 Mbits of on-chip RAM, 822 I/Os, and a clearly defined core voltage range—makes it a practical choice for designs that need substantial on-chip resources and dense external connectivity.
This device is well suited to engineering teams and procurement groups developing complex digital systems that require scalable logic, local memory buffering, and a high pin-count interface in a surface-mount package while operating within commercial temperature limits.
Please request a quote or submit your requirements to receive pricing, lead-time, and availability information for EP1S40F1508C7.

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