EP1S40F1508C7

IC FPGA 822 I/O 1508FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 822 3423744 41250 1508-BBGA, FCBGA

Quantity 1,980 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1508-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O822Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1S40F1508C7 – Stratix® Field Programmable Gate Array (FPGA), 1508-BBGA

The EP1S40F1508C7 is a Stratix® FPGA from Altera in a 1508-BBGA (FCBGA) package, offering a combination of high logic capacity, substantial embedded memory, and a large I/O complement for complex digital designs. It is a commercial-grade, surface-mount FPGA that supports a 1.425 V to 1.575 V core supply and is specified for 0 °C to 85 °C operation.

With 41,250 logic elements and approximately 3.4 Mbits of on-chip RAM, this device targets applications that require significant programmable logic, memory resources, and dense external connectivity in a compact FCBGA footprint.

Key Features

  • Core Logic  41,250 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
  • Embedded Memory  Approximately 3.4 Mbits of on-chip RAM to support buffering, state storage, and local data processing without relying on external memory.
  • I/O Capacity  Up to 822 I/O pins to accommodate high-density external interfaces and multi-channel connectivity.
  • Package and Mounting  1508-BBGA (FCBGA) package, supplier device package 1508-FBGA (40×40), designed for surface-mount assembly to save board area.
  • Power  Core voltage supply range of 1.425 V to 1.575 V for defined power domain requirements.
  • Temperature and Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Compliance  RoHS-compliant construction for environmental compatibility in regulated assemblies.

Typical Applications

  • High-density interface bridging  Use the 822 I/O pins and large logic capacity to implement custom protocol translation and multi-interface bridging between peripherals and system buses.
  • Data buffering and pre-processing  Leverage approximately 3.4 Mbits of embedded memory for on-chip buffering and local data manipulation ahead of external processing stages.
  • Custom control and state machines  Deploy the 41,250 logic elements to implement complex control algorithms, sequencers, and finite-state machines for system-level control.

Unique Advantages

  • High integration  Combines a large logic fabric and substantial on-chip RAM to reduce the need for external discrete logic and memory.
  • Extensive external connectivity  822 I/O pins support multiple parallel interfaces, sensors, and peripheral channels without extensive multiplexing.
  • Compact FCBGA footprint  The 1508-BBGA (40×40) supplier package enables dense board integration while retaining high pin count.
  • Defined power envelope  A clear core supply range (1.425 V–1.575 V) simplifies power-supply design and verification.
  • Commercial-grade specification  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic systems.
  • RoHS compliant  Built to meet environmental compliance requirements for regulated markets.

Why Choose EP1S40F1508C7?

The EP1S40F1508C7 positions itself as a high-capacity, commercially rated FPGA option that balances programmable logic, embedded memory, and a large I/O count within a compact FCBGA package. Its specification set—41,250 logic elements, approximately 3.4 Mbits of on-chip RAM, 822 I/Os, and a clearly defined core voltage range—makes it a practical choice for designs that need substantial on-chip resources and dense external connectivity.

This device is well suited to engineering teams and procurement groups developing complex digital systems that require scalable logic, local memory buffering, and a high pin-count interface in a surface-mount package while operating within commercial temperature limits.

Please request a quote or submit your requirements to receive pricing, lead-time, and availability information for EP1S40F1508C7.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up