EP1S40F780C5N

IC FPGA 615 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 615 3423744 41250 780-BBGA, FCBGA

Quantity 876 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O615Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1S40F780C5N – Stratix® Field Programmable Gate Array (FPGA), 41,250 logic elements

The EP1S40F780C5N is a Stratix® FPGA from Intel featuring 41,250 logic elements, approximately 3.42 Mbits of embedded memory, and 615 I/O pins. It integrates Stratix architecture building blocks—logic array elements, on-chip memory, DSP interfaces, and advanced I/O—to support dense programmable logic and complex interfacing within a single device.

Packaged in a 780‑FBGA (29×29) surface-mount format and specified for commercial operation (0 °C to 85 °C), the device operates from a core supply range of 1.425 V to 1.575 V and complies with RoHS requirements.

Key Features

  • Logic Capacity  41,250 logic elements provide substantial programmable fabric for implementing custom logic, control, and datapath functions.
  • Embedded Memory  Approximately 3.42 Mbits of on-chip RAM (TriMatrix memory architecture referenced in device documentation) for packet buffers, FIFOs, and local storage.
  • High I/O Count  615 I/O pins enable broad external interfacing and flexible system-level connectivity.
  • Advanced I/O Structure  Device documentation references double-data-rate I/O support, differential on-chip termination, programmable drive strength, and other advanced I/O capabilities for high-speed interfacing.
  • Clocking and PLLs  Stratix device handbook details global and hierarchical clocking, enhanced and fast PLLs, and dedicated clock networks for multi-clock and timing-critical designs.
  • DSP & Multiplier Support  The family documentation includes DSP block interfaces and multiplier resources for arithmetic- and signal-processing tasks.
  • Configuration & Testability  JTAG (IEEE 1149.1) boundary-scan support and embedded logic analyzer capabilities are described in the device handbook to aid development and debug.
  • Package & Mounting  780‑BBGA, FCBGA package (780‑FBGA, 29×29) in surface-mount format suitable for compact system integration.
  • Commercial Grade & Compliance  Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
  • Supply Voltage  Core supply range specified at 1.425 V to 1.575 V.

Typical Applications

  • I/O‑intensive systems  Use the 615 available I/O pins and advanced I/O capabilities for complex external interfacing and multi-domain connectivity.
  • Embedded memory buffering  Leverage approximately 3.42 Mbits of on-chip RAM for packet buffering, data alignment, and local storage in streaming applications.
  • Signal processing and math engines  Use the documented DSP block interfaces and multiplier resources for custom arithmetic pipelines and real-time processing tasks.
  • Multi-clock systems  Implement hierarchical clocking and PLL-based clock distribution for designs that require multiple clock domains and precise timing control.

Unique Advantages

  • Substantial programmable fabric: 41,250 logic elements enable dense implementation of control, glue logic, and custom datapaths without external ASICs.
  • Integrated memory resources: Approximately 3.42 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage needs.
  • Broad external interfacing: 615 I/O pins and documented advanced I/O features provide flexibility for diverse peripherals and bus interfaces.
  • Comprehensive timing support: Documented PLLs and global/hierarchical clocking structures help manage complex timing and multi-rate designs.
  • Development and test support: Standard JTAG boundary-scan and embedded logic analyzer capabilities aid bring-up and in-system debug.
  • RoHS compliant, commercial-grade: Surface-mount 780‑FBGA package with commercial temperature rating simplifies procurement and integration for commercial products.

Why Choose EP1S40F780C5N?

The EP1S40F780C5N combines a sizable logic resource (41,250 logic elements) with substantial on-chip memory (approximately 3.42 Mbits) and a high I/O count (615 pins) in a compact 780‑FBGA package. Backed by the Stratix device documentation, it provides documented clocking, DSP, I/O, and configuration features to support complex programmable designs within a commercial temperature envelope.

This device is well suited for engineers and designers who require dense programmable logic, integrated memory, and extensive I/O in a RoHS‑compliant, surface-mount FPGA packaged solution.

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