EP1S40F780C7N

The EP1S40F780C7N is a Stratix® Field Programmable Gate Array (FPGA) in a 780-BBGA FCBGA package designed for complex, logic-dense FPGA designs. It integrates a large array of logic elements, substantial on-chip RAM, and a high I/O count to support system-level functions such as DSP, memory interfacing, and high-pin-count control.

Targeted at commercial-grade applications, the device operates from a 1.425 V to 1.575 V core supply and across a 0 °C to 85 °C operating range. Its surface-mount 780-FBGA (29×29) package and RoHS compliance make it suitable for production assembly and regulatory requirements.

Key Features

• Logic Capacity Approximately 41,250 logic elements and 4,125 LABs/CLBs provide a sizable fabric for implementing complex logic, control, and datapath functions.
• Embedded Memory Approximately 3.42 Mbits of on-chip RAM supports large buffers, FIFOs, and local storage for streaming and packet-processing designs.
• I/O Resources 615 I/O pins enable wide bus interfaces, multi-channel data acquisition, and extensive peripheral connectivity for system integration.
• Power Supply Specified core voltage range of 1.425 V to 1.575 V for consistent core operation and predictable power sequencing in board designs.
• Package & Mounting 780-FBGA (29×29) FCBGA, surface-mount package suitable for automated assembly on standard PCB processes.
• Operating Grade & Temperature Commercial grade device rated for 0 °C to 85 °C operation, suitable for standard commercial electronics and systems.
• Regulatory RoHS compliant to support environmentally conscious manufacturing and assembly requirements.

Typical Applications

• High-speed data processing — Use the device's large logic array and embedded RAM to implement DSP pipelines, packet processing, and streaming data engines.
• Memory interface controllers — Leverage on-chip memory and abundant I/Os to build controllers for external RAM and high-bandwidth memory interfaces.
• Multi-channel I/O systems — 615 I/O pins support multi-lane communication, sensor aggregation, and complex peripheral interfacing in communication and instrumentation equipment.
• System integration & prototyping — The surface-mount FCBGA package and substantial logic resources make the device suitable for integrating multiple functions into a single FPGA-based subsystem.

Unique Advantages

• Substantial logic density: 41,250 logic elements provide headroom to implement complex finite-state machines, datapaths, and custom accelerators on one device.
• Significant on-chip memory: Approximately 3.42 Mbits of embedded RAM reduces dependence on external memory for buffering and low-latency storage.
• High I/O count: 615 I/O pins simplify board-level routing for multi-channel and parallel interfaces, reducing the need for external multiplexing.
• Production-ready package: 780-FBGA (29×29) surface-mount packaging supports automated PCB assembly workflows.
• predictable core supply window: A defined core voltage range (1.425 V–1.575 V) helps ensure consistent electrical integration and power-design planning.
• RoHS compliant: Conforms to common environmental requirements for commercial electronics manufacturing.

Why Choose EP1S40F780C7N?

The EP1S40F780C7N positions itself as a commercially graded Stratix FPGA option for designs that require a balance of large logic capacity, embedded memory, and extensive I/O in a production-ready BGA package. Its specification set—41,250 logic elements, approximately 3.42 Mbits of on-chip RAM, and 615 I/Os—supports integration of multiple subsystems and complex datapath implementations on a single device.

This device is suitable for engineering teams building commercial electronic systems that need scalable logic resources, predictable supply requirements, and RoHS compliance. Its package and electrical characteristics make it appropriate for production assembly and longer-term platform designs where integration and system-level functionality are priorities.

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