EP1S40F780I6N

The EP1S40F780I6N is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, configurable logic applications. This device provides 41,250 logic elements, approximately 3.4 Mbits of embedded RAM (3,423,744 total RAM bits), and 615 general-purpose I/O pins in a 780‑ball FCBGA package.

Documented in the Stratix Device Handbook, the device family offers a broad set of architecture elements such as memory, clocking, DSP interfaces and configurable I/O, making this part suitable for industrial applications that require robust operating range and high pin-count integration.

Key Features

• Core Logic  41,250 logic elements for implementing complex, high-density digital designs.
• Embedded Memory  Approximately 3.4 Mbits of on-chip RAM (3,423,744 total RAM bits) to support buffering, packet storage, and local data structures.
• I/O Capacity  615 I/O pins to connect wide interfaces, multiple peripherals, and parallel buses in high-pin-count systems.
• Clocking and DSP Support  Stratix device handbook references dedicated clock networks, PLLs, and DSP/multiplier resources for synchronized high‑performance data paths.
• Configuration & Test  Supports IEEE 1149.1 (JTAG) boundary-scan and embedded logic analysis capabilities as described in the device documentation for in-system test and debug.
• Package & Mounting  780‑BBGA (FCBGA) surface-mount package, supplier package listed as 780‑FBGA (29×29), for compact board-level integration.
• Power & Supply  Core voltage supply range 1.425 V to 1.575 V to match common FPGA core rails.
• Operating Range & Compliance  Industrial temperature rating from −40 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

• Industrial Control  Implement real-time control, sequencing and logic consolidation using the device’s 41,250 logic elements and industrial temperature range (−40 °C to 100 °C).
• Communications Infrastructure  High I/O count (615 pins) and on-chip memory are suitable for data-plane logic, protocol bridging, and interface aggregation in networking equipment.
• High‑Performance Embedded Systems  Combine extensive logic capacity and approximately 3.4 Mbits of embedded RAM to implement custom accelerators and system controllers.
• Imaging and Test Equipment  Use abundant I/O and memory to handle parallel data capture, preprocessing and buffering in instrumentation and imaging systems.

Unique Advantages

• High Logic Density: 41,250 logic elements provide significant capacity for complex algorithms and multi-function designs, reducing the need for multiple FPGAs.
• Substantial On‑Chip Memory: Approximately 3.4 Mbits of embedded RAM supports local buffering and data handling without immediate reliance on external memory.
• Extensive I/O Resources: 615 I/Os enable broad connectivity for multi-channel systems, high-pin interfaces, and parallel sensor arrays.
• Documented Stratix Architecture: The Stratix Device Handbook details clocking, PLLs, I/O structure, memory modes and DSP interfaces, aiding design and verification.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation for deployment in temperature-stressed environments.
• RoHS Compliant: Meets RoHS requirements for materials and environmental compliance.

Why Choose EP1S40F780I6N?

The EP1S40F780I6N positions itself as a high-density Stratix FPGA option for engineers who need a combination of abundant logic, sizeable on-chip memory and a large I/O fabric in a compact FCBGA package. Its documented Stratix architecture elements—clock networks, memory modes, DSP interfaces and configuration/test features—provide a clear foundation for complex system designs.

This device is well suited to teams building industrial and infrastructure equipment that require sustained operation across a wide temperature range and strong integration to reduce board-level complexity. The detailed device documentation supports design, configuration and in-system debug to accelerate development and validation.

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