EP1S60B956I7

The EP1S60B956I7 is a Stratix® field programmable gate array (FPGA) manufactured by Altera, delivered in a 956‑BBGA (FCBGA) package. It provides a high logic density device with 57,120 logic elements, substantial on‑chip memory, and a large I/O count for industrial-grade programmable logic designs.

With a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, this surface‑mount FPGA targets industrial applications that demand robust environmental performance and flexible I/O integration.

Key Features

• Core Capacity — 57,120 logic elements provide a high-density fabric for implementing complex logic functions and custom processing pipelines.
• Embedded Memory — Total on‑chip RAM of 5,215,104 bits (approximately 5.2 Mbits) to support buffering, state storage, and memory‑intensive logic.
• I/O — 683 user I/O pins to accommodate wide buses, parallel interfaces, and high‑channel connectivity requirements.
• Power — Operates from a core supply range of 1.425 V to 1.575 V to match system power requirements.
• Package & Mounting — 956‑BBGA (supplier device package: 956‑BGA, 40×40) in a surface‑mount form factor for compact PCB implementations.
• Temperature & Grade — Industrial grade device specified for operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead‑free manufacturing.

Typical Applications

• Industrial control systems — Use the device’s industrial temperature rating and high logic density to implement control algorithms, motor control logic, and real‑time decision making.
• High‑density I/O designs — Leverage 683 I/O pins for complex sensor arrays, parallel interfaces, or multi‑channel data acquisition front ends.
• Embedded memory buffering — Utilize approximately 5.2 Mbits of on‑chip RAM for packet buffering, FIFO staging, and temporary data storage in streaming applications.
• Compact PCB implementations — The 956‑BBGA (40×40) surface mount package supports space‑constrained boards while maintaining high integration.

Unique Advantages

• High logic integration: 57,120 logic elements enable implementation of complex, consolidated logic functions that reduce external components.
• Substantial embedded memory: Approximately 5.2 Mbits of on‑chip RAM lowers reliance on external memory for many buffering and state‑storage needs.
• Extensive I/O availability: 683 I/O pins provide flexibility for interfacing to numerous peripherals, buses, and high‑channel systems.
• Industrial temperature performance: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact BGA packaging: The 956‑BGA (40×40) package delivers high pin count in a compact surface‑mount footprint for dense board layouts.
• Regulatory readiness: RoHS compliance supports lead‑free assembly and environmental regulations.

Why Choose EP1S60B956I7?

The EP1S60B956I7 combines high logic capacity, significant on‑chip memory, and a very large I/O count in an industrial‑grade, surface‑mount 956‑BBGA package. These attributes make it well suited for industrial and embedded designs that require dense programmable logic, substantial buffering, and broad connectivity while operating across a wide temperature range.

For engineers and procurement teams designing ruggedized or space‑constrained systems, the EP1S60B956I7 offers a balanced solution of integration, environmental robustness, and compliance that supports long‑life deployments and streamlined system BOMs.

Request a quote or submit an inquiry for pricing and availability of EP1S60B956I7 to evaluate it for your next industrial FPGA design.