EP1S60F1020C6N

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

Quantity 516 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60F1020C6N – Stratix® Field Programmable Gate Array (FPGA), 1020-BBGA

The EP1S60F1020C6N is a Stratix® FPGA device designed to deliver high logic density, substantial embedded memory, and a large I/O complement in a 1020-BBGA package. Its architecture and family documentation provide on-chip resources and infrastructure for applications that require dense programmable logic, multi-megabit embedded RAM, and advanced I/O and clocking features.

Supplied in a surface-mount 1020-FBGA (33 × 33) package and rated for commercial operation, the device addresses designs where high I/O count and significant internal memory are primary requirements.

Key Features

  • Logic Capacity — 57,120 logic elements and 5,712 LABs provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 5.2 Mbits of on-chip RAM available for buffering, FIFOs, and embedded data structures.
  • I/O Density & Packaging — 773 I/O pins in a 1020-BBGA package (supplier package: 1020-FBGA, 33 × 33) on a surface-mount device for high-pin-count board designs.
  • Clocking and PLLs — Family documentation includes extensive clocking resources including global/hierarchical clocking and enhanced & fast PLLs for flexible clock management.
  • DSP and Multiplier Resources — Dedicated multiplier blocks and DSP block interfaces are part of the device architecture for arithmetic and signal-processing functions.
  • Advanced I/O Structure — The Stratix family handbook documents a comprehensive I/O structure with support for DDR I/O, programmable drive strength, slew-rate control, programmable pull-ups, and differential on-chip termination.
  • Configuration & Test Support — Supports IEEE 1149.1 (JTAG) boundary-scan, SignalTap II embedded logic analyzer, partial reconfiguration, and multiple configuration schemes as described in the device handbook.
  • Electrical & Environmental — Voltage supply: 1.425 V to 1.575 V. Operating temperature range: 0 °C to 85 °C. RoHS compliant; commercial grade.

Typical Applications

  • High-density digital systems — Use the device where large numbers of logic elements and embedded RAM are required for complex control, protocol engines, or custom processors.
  • High-pin-count interfaces — Leverage 773 I/Os for multi-channel data paths, wide parallel interfaces, or board-level consolidation of multiple signals.
  • Signal processing and arithmetic — Employ the device’s multiplier blocks and DSP interfaces for fixed-point DSP functions and stream processing.
  • Memory interfacing and buffering — Use the embedded RAM and documented external RAM interfacing methods for buffering, packet FIFOs, and temporary storage.

Unique Advantages

  • High logic and LAB count: 57,120 logic elements across 5,712 LABs enable large-scale, integrated logic implementations without external CPLDs or discrete logic.
  • Substantial on-chip RAM: Approximately 5.2 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
  • Very large I/O complement: 773 I/Os in a 1020-BBGA footprint allow consolidation of multiple interfaces and simplify system routing.
  • Comprehensive clocking resources: Enhanced and fast PLLs and hierarchical clock networks support flexible timing architectures and multiple synchronous domains.
  • Built-in test and configuration features: JTAG boundary-scan, SignalTap II, and partial reconfiguration options simplify development, validation, and in-field updates.
  • Documented I/O capabilities: The device handbook details advanced I/O features (DDR, differential termination, programmable drive/slew) to help implement robust board interfaces.

Why Choose EP1S60F1020C6N?

The EP1S60F1020C6N combines a large logic fabric, multi-megabit embedded RAM, and very high I/O density in a compact 1020-BBGA package, making it suitable for designs that need extensive on-chip resources and complex interfacing. Its documented clocking, DSP, and I/O capabilities give designers the architectural building blocks required for demanding digital and signal-processing applications.

For teams designing commercial-grade systems that prioritize integration and board-level I/O consolidation, this Stratix FPGA offers a balance of programmable capacity, embedded memory, and configuration/test features supported by comprehensive family documentation.

Request a quote or submit an inquiry to obtain pricing and availability for the EP1S60F1020C6N.

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