EP1S60F1020C7

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

Quantity 453 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60F1020C7 – Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

The EP1S60F1020C7 is a Stratix® family FPGA from Intel offering a high-density, configurable logic fabric intended for complex digital designs. The device combines a large pool of logic elements with substantial on-chip RAM and a high I/O count to support demanding interfacing and data-path requirements.

Designed around the Stratix architecture described in the device handbook, the part provides features such as programmable clocking and PLL networks, DSP/multiplier resources, configurable memory modes, and advanced configuration and test options. Typical target uses include high-throughput signal processing, communication interfaces, and applications requiring dense logic and memory integration.

Key Features

  • Logic Capacity — 57,120 logic elements for building complex, configurable digital functions and custom datapaths.
  • Embedded Memory — Approximately 5.2 Mbits of on-chip RAM to support buffering, packet storage, and local data tables.
  • I/O Density — 773 I/O pins to enable high-pin-count interfacing and dense board-level connectivity.
  • Clocking and Timing — Stratix architecture includes PLLs and clock networks for flexible clocking, global and hierarchical clock distribution, and synchronization options.
  • DSP and Multiplier Support — Dedicated multiplier/DSP block interfaces for accelerating signal-processing and arithmetic-heavy functions.
  • Memory and External RAM Interfacing — Multiple memory modes and external RAM interfacing support documented in the device handbook for system memory integration.
  • Configuration & Test — Support for IEEE 1149.1 (JTAG) boundary-scan, SignalTap II embedded logic analysis, and flexible configuration schemes including partial and remote update modes.
  • Package & Mounting — Surface-mount 1020-FBGA (33×33) supplier package; package case listed as 1020-BBGA for board-level integration.
  • Power and Temperature — Voltage supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
  • Environmental — RoHS compliant.

Typical Applications

  • High-throughput signal processing — On-chip DSP blocks, multipliers, and substantial embedded RAM enable real-time filtering, transforms, and other compute-intensive pipelines.
  • Communications and networking — High I/O count combined with programmable clocking and high-speed I/O support address packet processing, protocol bridging, and timing-critical link logic.
  • Video and imaging — Large logic and memory resources support frame buffering, image pipelines, and custom video processing engines.
  • Custom hardware acceleration & prototyping — Dense logic fabric and flexible configuration/testing features such as JTAG and SignalTap II facilitate hardware acceleration and iterative development workflows.

Unique Advantages

  • High logic and memory density: 57,120 logic elements and approximately 5.2 Mbits of embedded RAM provide the resources needed for complex, stateful designs.
  • Extensive I/O capability: 773 I/O pins reduce the need for external multiplexing and simplify integration with high-channel-count systems.
  • Flexible clocking: Built-in PLLs and hierarchical clock networks enable precise timing control across large designs.
  • On-chip DSP support: Multiplier and DSP block interfaces accelerate arithmetic-intensive workloads while keeping data local to the FPGA fabric.
  • Comprehensive configuration and debug: JTAG boundary-scan, SignalTap II embedded logic analyzer, and support for partial/reconfigurable updates streamline development and in-field updates.
  • Commercial-grade and RoHS compliant: Specified for 0 °C to 85 °C operation and RoHS conformity for regulatory and manufacturing compatibility.

Why Choose EP1S60F1020C7?

The EP1S60F1020C7 delivers a combination of high logic density, substantial embedded memory, and a broad set of architecture features drawn from the Stratix device family handbook. Its mix of programmable logic, DSP/multiplier resources, flexible clocking, and a large I/O complement makes it appropriate for designs that require integrated processing, complex interfacing, and robust configuration and debug capabilities.

Engineers designing communication, signal-processing, video, or custom acceleration hardware will find the device's capacity and documented architecture useful for scalable implementations. The device is supported by the Stratix device documentation covering memory modes, PLLs, I/O structure, and configuration pathways to aid development and deployment.

Request a quote or submit a pricing inquiry for EP1S60F1020C7 to check availability and lead times for your project requirements.

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