EP1S60F1020C7N

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

Quantity 566 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60F1020C7N – Stratix® FPGA, 57,120 logic elements, approximately 5.22 Mbits RAM, 773 I/Os, 1020-BBGA

The EP1S60F1020C7N is a Stratix® family field programmable gate array (FPGA) from Intel, delivered in a 1020-BBGA surface-mount package. It provides a high-density programmable fabric with abundant on-chip memory and a large I/O count for demanding digital designs.

This device targets commercial-grade applications that require extensive logic resources, embedded memory, flexible clocking and rich I/O options, while operating within a 0 °C to 85 °C temperature range and a core supply voltage of 1.425 V to 1.575 V.

Key Features

  • Logic Capacity  Approximately 57,120 logic elements (LEs) for implementing complex digital functions and custom architectures.
  • Embedded Memory  Approximately 5.22 Mbits of on-chip RAM to support frame buffers, lookup tables, and other data-intensive functions.
  • High I/O Count  773 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive board-level routing.
  • Package & Mounting  1020-BBGA package; supplier device package listed as 1020-FBGA (33×33). Surface-mount mounting type.
  • Power & Temperature  Core supply voltage range 1.425 V to 1.575 V. Commercial operating temperature range 0 °C to 85 °C.
  • Programmable Clocking  Integrated PLLs and clock network features for flexible clock distribution and phase management (see Stratix device handbook sections on PLLs & clock networks).
  • Advanced I/O Capabilities  Support for double-data-rate I/O and advanced I/O standards, along with programmable drive strength and on-chip termination options described in device documentation.
  • DSP & Arithmetic Resources  Dedicated multiplier and DSP-oriented blocks for arithmetic- and signal-processing workloads (referenced in Stratix architecture documentation).
  • Configuration & Debug Support  JTAG boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes including partial reconfiguration as documented for the Stratix family.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density logic systems  Use the large logic element count to implement wide datapaths, custom processors, and complex state machines.
  • Memory-intensive designs  Leverage approximately 5.22 Mbits of embedded RAM for buffering, lookup tables, and packet/frame storage.
  • High-throughput I/O interfaces  Take advantage of 773 I/Os and DDR-capable pins for multi-lane interfaces, parallel buses, and wide peripheral connectivity.
  • Signal processing and arithmetic  Employ integrated multiplier/DSP blocks for fixed-point and streaming signal-processing tasks.

Unique Advantages

  • High logic integration: Approximately 57,120 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Substantial embedded memory: Approximately 5.22 Mbits of on-chip RAM supports in-hardware buffering and data staging without external memory.
  • Extensive I/O resources: 773 I/O pins provide design flexibility for broad peripheral and interface support, enabling wide parallelism and connectivity.
  • Flexible clocking and timing: Integrated PLLs and comprehensive clock networks support complex timing architectures and multi-domain designs.
  • Built-in configuration and debug tools: On-chip support for JTAG, SignalTap II, and partial reconfiguration simplifies development, bring-up, and in-field updates.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial applications.

Why Choose EP1S60F1020C7N?

The EP1S60F1020C7N combines a high logic element count, substantial embedded memory, and a large I/O complement in a 1020-BBGA surface-mount package, making it a strong choice for commercial designs that require integrated digital processing, wide connectivity, and flexible clocking. Its Stratix architecture features—documented support for advanced I/O, PLLs, DSP resources, and on-chip debug/configuration—align it with projects that need a programmable, high-density solution with robust development capabilities.

This device is appropriate for engineering teams building complex FPGA-based systems who require scalability, on-chip memory resources, and extensive I/O, backed by the Stratix device documentation and development ecosystem.

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