EP1S60F1508C6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 1508-BBGA, FCBGA |
|---|---|
| Quantity | 687 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA (30x30) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 1203 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5712 | Number of Logic Elements/Cells | 57120 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5215104 |
Overview of EP1S60F1508C6N – Stratix® Field Programmable Gate Array (FPGA) IC 1508-BBGA, FCBGA
The EP1S60F1508C6N is an Altera Stratix® field programmable gate array designed for high-density digital designs. It combines a large logic fabric, substantial on-chip memory, and a very high I/O count in a compact 1508-BBGA FCBGA surface-mount package.
Targeted at commercial-temperature applications, this device is suited to systems that require extensive logic resources, significant embedded memory, and dense external interfacing while maintaining RoHS compliance.
Key Features
- Logic Capacity Approximately 57,120 logic elements provide the programmable resources needed for complex digital functions and system-on-chip style integration.
- Embedded Memory Total on-chip RAM of 5,215,104 bits (approximately 5.2 Mbits) supports FIFOs, buffering, and on-die storage for algorithm implementation.
- High I/O Density 1,203 available I/O pins enable extensive external interfacing for multi-channel designs, parallel buses, or large connector arrays.
- Power Supply Operates from a core voltage supply range of 1.425 V to 1.575 V, supporting designs with defined core voltage requirements.
- Package & Mounting 1508-BBGA FCBGA package (supplier package: 1508-FBGA, 30×30) in a surface-mount format for compact board-level integration.
- Operating Grade Commercial temperature range from 0 °C to 85 °C, suitable for standard commercial electronics deployments.
- Environmental Compliance RoHS compliant for lead-free manufacturing and assembly processes.
Typical Applications
- High-density digital systems Use the large logic capacity to implement complex state machines, custom processors, and parallel datapaths within a single FPGA.
- I/O-rich interface hubs Leverage the 1,203 I/Os to aggregate multiple external buses, sensors, or communication channels in a compact design.
- Embedded memory buffering Apply the approximately 5.2 Mbits of on-chip RAM for data buffering, packet queues, and temporary storage in streaming or packetized systems.
- Board-level integration The 1508-BBGA FCBGA surface-mount package supports dense board layouts where space and pin-count are critical.
Unique Advantages
- Large programmable fabric: Provides roughly 57,120 logic elements to consolidate multiple functions into a single device and reduce external ASIC/FPGA count.
- Substantial on-chip memory: Approximately 5.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Exceptional I/O capacity: 1,203 I/Os enable flexible interfacing and simplify routing of multi-channel or multi-protocol systems.
- Compact FCBGA packaging: The 1508-BBGA (30×30) package delivers high pin density in a surface-mount form factor for space-constrained PCBs.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments and environments.
- RoHS compliant: Supports lead-free manufacturing and assembly requirements.
Why Choose EP1S60F1508C6N?
The EP1S60F1508C6N is positioned for designers who need a high-density FPGA with extensive logic resources, generous embedded memory, and very high I/O capacity in a compact surface-mount package. Its combination of approximately 57,120 logic elements, about 5.2 Mbits of on-chip RAM, and 1,203 I/Os makes it well suited for complex commercial electronic systems that consolidate multiple functions into a single FPGA.
Backed by Altera’s Stratix family lineage and offered in a 1508-BBGA FCBGA package with RoHS compliance and a commercial operating range, this device provides a balance of integration and board-level density for long-lived, scalable commercial designs.
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