EP1S60F1020I6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA |
|---|---|
| Quantity | 1,142 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 773 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5712 | Number of Logic Elements/Cells | 57120 | ||
| Number of Gates | N/A | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5215104 |
Overview of EP1S60F1020I6N – Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA
The EP1S60F1020I6N is a Stratix® FPGA device providing a high-density programmable fabric optimized for complex digital designs. It integrates 57,120 logic elements and approximately 5.2 Mbits of embedded memory, making it suitable for large logic implementations and on-chip data buffering.
Designed for industrial-grade applications, the device offers 773 I/O pins, a 1020-ball BGA package (supplier device package: 1020-FBGA, 33×33), and an operating range from -40 °C to 100 °C. The device is supplied for core operation at 1.425 V–1.575 V and is RoHS compliant.
Key Features
- High-density core — 57,120 logic elements provide the capacity for complex state machines, custom accelerators, and large-scale glue logic.
- Embedded memory — Approximately 5.2 Mbits of on-chip RAM for FIFOs, buffers, and small data stores to reduce external memory dependencies.
- Extensive I/O — 773 user I/Os support broad system interfacing, high pin-count connectivity, and multiple parallel buses.
- Package and mounting — 1020-BBGA package (supplier package: 1020-FBGA, 33×33) in a surface-mount form factor for compact board-level integration.
- Industrial temperature range — Rated for -40 °C to 100 °C operation to meet demanding environmental requirements.
- Core supply — Specified core voltage range of 1.425 V to 1.575 V for predictable power delivery and design margin.
- Configuration, debugging and test support — Device documentation references JTAG boundary-scan and embedded logic analysis capabilities for configuration, in-system test, and on-chip debugging workflows.
- Clocking and DSP support — Device handbook details PLLs, clock networks, and DSP/multiplier resources to support timing control and signal-processing functions.
- Memory architecture — On-chip TriMatrix memory and configurable memory modes described in the device handbook for flexible memory usage and interfacing.
- Standards and compliance — RoHS compliant and manufactured to industrial-grade specifications.
Typical Applications
- High-density digital systems — Implement complex state machines, protocol bridges, and custom logic that require tens of thousands of logic elements and significant embedded memory.
- Signal processing and DSP — Leverage the device’s DSP and multiplier resources along with on-chip memory for data-path acceleration and real-time processing.
- High-pin-count interfacing — Use the 773 I/Os for dense parallel bus connections, multi-channel I/O, or complex sensor/actuator interfacing.
- Memory-centric designs — Utilize approximately 5.2 Mbits of embedded RAM and on-chip memory modes for buffering, packet buffering, and low-latency data storage.
Unique Advantages
- Significant logic capacity: 57,120 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
- Large embedded memory: Approximately 5.2 Mbits of on-chip RAM minimizes external memory bandwidth requirements and simplifies PCB design.
- High I/O count: 773 I/Os enable diverse peripheral and bus integration without resorting to multiple interface chips.
- Industrial-grade thermal range: Rated from -40 °C to 100 °C for reliable operation in demanding environments.
- Comprehensive device documentation: The Stratix device handbook provides detail on architecture, clocking, memory modes, configuration, and test features to support engineering evaluation and system design.
- RoHS compliant: Meets environmental restrictions for modern product design and manufacturing.
Why Choose EP1S60F1020I6N?
The EP1S60F1020I6N positions itself as a high-capacity Stratix FPGA option for industrial designs that require a balance of large logic resources, substantial embedded memory, and extensive I/O. Its documented architecture and feature set—covering clock networks, memory modes, DSP resources, and configuration/test facilities—support complex, performance-oriented implementations while simplifying system integration.
This device is suited to engineering teams building dense digital systems, signal-processing pipelines, and high-pin-count interfaces who need a vendor-documented platform with industrial temperature support and RoHS compliance.
Request a quote or submit an inquiry to get pricing, availability, and further technical information for EP1S60F1020I6N. Technical documentation, including the Stratix device handbook, is available from the manufacturer's product literature.

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