EP1S60F1020I6N

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

Quantity 1,142 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60F1020I6N – Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

The EP1S60F1020I6N is a Stratix® FPGA device providing a high-density programmable fabric optimized for complex digital designs. It integrates 57,120 logic elements and approximately 5.2 Mbits of embedded memory, making it suitable for large logic implementations and on-chip data buffering.

Designed for industrial-grade applications, the device offers 773 I/O pins, a 1020-ball BGA package (supplier device package: 1020-FBGA, 33×33), and an operating range from -40 °C to 100 °C. The device is supplied for core operation at 1.425 V–1.575 V and is RoHS compliant.

Key Features

  • High-density core — 57,120 logic elements provide the capacity for complex state machines, custom accelerators, and large-scale glue logic.
  • Embedded memory — Approximately 5.2 Mbits of on-chip RAM for FIFOs, buffers, and small data stores to reduce external memory dependencies.
  • Extensive I/O — 773 user I/Os support broad system interfacing, high pin-count connectivity, and multiple parallel buses.
  • Package and mounting — 1020-BBGA package (supplier package: 1020-FBGA, 33×33) in a surface-mount form factor for compact board-level integration.
  • Industrial temperature range — Rated for -40 °C to 100 °C operation to meet demanding environmental requirements.
  • Core supply — Specified core voltage range of 1.425 V to 1.575 V for predictable power delivery and design margin.
  • Configuration, debugging and test support — Device documentation references JTAG boundary-scan and embedded logic analysis capabilities for configuration, in-system test, and on-chip debugging workflows.
  • Clocking and DSP support — Device handbook details PLLs, clock networks, and DSP/multiplier resources to support timing control and signal-processing functions.
  • Memory architecture — On-chip TriMatrix memory and configurable memory modes described in the device handbook for flexible memory usage and interfacing.
  • Standards and compliance — RoHS compliant and manufactured to industrial-grade specifications.

Typical Applications

  • High-density digital systems — Implement complex state machines, protocol bridges, and custom logic that require tens of thousands of logic elements and significant embedded memory.
  • Signal processing and DSP — Leverage the device’s DSP and multiplier resources along with on-chip memory for data-path acceleration and real-time processing.
  • High-pin-count interfacing — Use the 773 I/Os for dense parallel bus connections, multi-channel I/O, or complex sensor/actuator interfacing.
  • Memory-centric designs — Utilize approximately 5.2 Mbits of embedded RAM and on-chip memory modes for buffering, packet buffering, and low-latency data storage.

Unique Advantages

  • Significant logic capacity: 57,120 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
  • Large embedded memory: Approximately 5.2 Mbits of on-chip RAM minimizes external memory bandwidth requirements and simplifies PCB design.
  • High I/O count: 773 I/Os enable diverse peripheral and bus integration without resorting to multiple interface chips.
  • Industrial-grade thermal range: Rated from -40 °C to 100 °C for reliable operation in demanding environments.
  • Comprehensive device documentation: The Stratix device handbook provides detail on architecture, clocking, memory modes, configuration, and test features to support engineering evaluation and system design.
  • RoHS compliant: Meets environmental restrictions for modern product design and manufacturing.

Why Choose EP1S60F1020I6N?

The EP1S60F1020I6N positions itself as a high-capacity Stratix FPGA option for industrial designs that require a balance of large logic resources, substantial embedded memory, and extensive I/O. Its documented architecture and feature set—covering clock networks, memory modes, DSP resources, and configuration/test facilities—support complex, performance-oriented implementations while simplifying system integration.

This device is suited to engineering teams building dense digital systems, signal-processing pipelines, and high-pin-count interfaces who need a vendor-documented platform with industrial temperature support and RoHS compliance.

Request a quote or submit an inquiry to get pricing, availability, and further technical information for EP1S60F1020I6N. Technical documentation, including the Stratix device handbook, is available from the manufacturer's product literature.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up