EP1S60F1020C6

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 5215104 57120 1020-BBGA

Quantity 338 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60F1020C6 – Stratix FPGA, 1020-BBGA

The EP1S60F1020C6 is a Stratix® Field Programmable Gate Array (FPGA) in a 1020-BBGA package designed for commercial applications. It provides a high logic density fabric with on-chip memory and an extensive I/O count for designs that require large-scale digital integration.

This device combines 57,120 logic elements, approximately 5.2 Mbits of embedded memory, and 773 I/Os, making it suitable for designs that need large programmable logic capacity, significant embedded RAM, and broad I/O connectivity while operating from a 1.425–1.575 V core supply.

Key Features

  • Logic Capacity — 57,120 logic elements and 5,712 logic array blocks provide substantial programmable resources for complex digital designs.
  • Embedded Memory — Approximately 5.2 Mbits of on-chip RAM for buffering, state storage, and data path implementation.
  • High I/O Count — 773 I/Os support wide parallel interfaces and dense external connectivity.
  • Clocking and DSP Support — Stratix family architecture includes PLLs, clock networks, multiplier and DSP-oriented blocks as documented in the device handbook to support high-performance timing and arithmetic functions.
  • Advanced I/O Capabilities — Architecture documentation describes support for double-data-rate I/O, high-speed differential I/O, programmable drive strength, on-chip termination, and multi-voltage I/O interfacing.
  • Configuration & Debug — Family features include JTAG boundary-scan support, SignalTap II embedded logic analyzer, partial reconfiguration, and remote-update configuration options as outlined in the Stratix device documentation.
  • Package & Mounting — 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) in a surface-mount form factor.
  • Electrical & Environmental — Core voltage supply range 1.425 V to 1.575 V; commercial-grade operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High-density logic integration — Implement complex custom logic and control functions using the device’s large logic element count and LAB structure.
  • Memory-intensive designs — Use the approximately 5.2 Mbits of embedded RAM for buffering, packet storage, and multiport memory needs.
  • High I/O interface bridging — Leverage 773 I/Os for wide parallel interfaces, protocol bridging, and dense board-level connectivity.
  • Timing-critical systems — Utilize the Stratix family’s PLLs and clock network capabilities for designs that require precise clocking and synchronization.

Unique Advantages

  • High logic density: 57,120 logic elements provide scalable capacity for large designs without adding external logic ICs.
  • Substantial on-chip RAM: Approximately 5.2 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage tasks.
  • Extensive I/O: 773 I/Os enable direct interfacing to wide buses, parallel sensors, and multiple peripherals, simplifying PCB routing and system partitioning.
  • Advanced I/O and clocking features: Family-level support for DDR I/O, differential signaling, PLLs, and dedicated DSP/multiplier blocks helps implement data-path and timing-sensitive functions on-chip.
  • Commercial-grade robustness: Rated for 0 °C to 85 °C operation with RoHS compliance for mainstream commercial deployments.
  • Compact surface-mount package: 1020-BBGA (1020-FBGA, 33×33) provides high pin count in a compact footprint for dense board designs.

Why Choose EP1S60F1020C6?

The EP1S60F1020C6 positions itself as a high-capacity Stratix FPGA option for commercial designs that demand large programmable logic, ample embedded memory, and a very high I/O count. Its combination of logic resources, memory, and family-level features such as advanced I/O, PLLs, and DSP-oriented blocks supports integration of substantial system functions onto a single device.

This device is well suited for engineering teams and procurement looking for a commercially graded FPGA that balances logic density, on-chip RAM, and connectivity while fitting into a compact 1020-BBGA surface-mount package. The device handbook content available for the Stratix family documents architecture and configuration options that support development, debugging, and deployment efforts.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EP1S60F1020C6.

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