EP1S60F1020C5N

The EP1S60F1020C5N is a Stratix® family FPGA from Intel, offered in a 1020-BBGA package with surface-mount construction. It provides a high-density programmable fabric with 57,120 logic elements and approximately 5.2 Mbits of embedded memory, alongside 773 general-purpose I/O pins.

Designed for system integration tasks that require dense logic, substantial on-chip RAM, and extensive I/O, this commercial-grade device operates from a 1.425 V to 1.575 V core supply and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 57,120 logic elements provide a large, flexible programmable fabric suitable for complex logic and system integration tasks.
• Embedded Memory Approximately 5.2 Mbits of on-chip RAM for data buffering, packet storage, and intermediate processing.
• High I/O Density 773 I/O pins support extensive external interfacing and high pin-count system designs.
• Advanced I/O and Clocking (Device Family) The Stratix device handbook documents support for features such as double-data-rate I/O, advanced I/O standards, multi‑volt I/O interfaces, high-speed differential I/O, and PLLs/clock networks for flexible timing architectures.
• DSP and Arithmetic Support (Device Family) Device-family features include dedicated multiplier and DSP block interfaces for signal processing and arithmetic-accelerated functions.
• Configuration & Test (Device Family) Family-level capabilities include IEEE 1149.1 (JTAG) boundary-scan support, SignalTap II embedded logic analysis, multiple configuration schemes and partial reconfiguration options.
• Package & Mounting 1020-BBGA package (supplier device package: 1020-FBGA, 33×33) in a surface-mount form factor for PCB assembly.
• Power & Temperature Core supply range 1.425 V–1.575 V and commercial operating temperature range of 0 °C–85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density I/O systems Use the 773 I/O pins and advanced I/O features for board-level designs requiring broad external connectivity and signal interfacing.
• Signal processing and DSP Leverage on-chip RAM and device-family DSP/multiplier resources for streaming data processing and arithmetic-accelerated functions.
• Custom logic and system integration Implement control logic, protocol bridging, and glue-logic consolidation within a single FPGA fabric to reduce BOM and board complexity.

Unique Advantages

• High logic capacity: 57,120 logic elements enable large-scale HDL designs and consolidation of multiple functions into one device.
• Substantial on-chip memory: Approximately 5.2 Mbits of embedded RAM simplifies buffering and state storage without relying on external memory.
• Extensive I/O: 773 I/O pins give designers flexibility to connect many peripherals, transceivers, and high-pin-count interfaces.
• Flexible packaging: 1020-BBGA / 1020-FBGA (33×33) surface-mount package supports high-density PCB layouts and automated assembly.
• Documented family-level capabilities: Family datasheet details advanced clocking, I/O options, configuration methods, and test features to support complex system designs.
• Regulatory awareness: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose EP1S60F1020C5N?

The EP1S60F1020C5N positions itself as a high-capacity Stratix FPGA option for designs that require significant logic resources, meaningful embedded memory, and a large number of I/O signals. Its documented family-level features for clocking, I/O standards, DSP blocks, and configuration make it suitable for consolidating multiple system functions into a single programmable device.

This commercial-grade device is well suited to engineering teams building complex digital systems who need scalability, on-chip memory resources, and extensive connectivity, backed by the Stratix device handbook and Intel’s device-family documentation.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for EP1S60F1020C5N.