EP1S60B956C6N

The EP1S60B956C6N is a Stratix® field programmable gate array (FPGA) in a 956-BBGA (40×40) package designed for high-density programmable logic applications. With 57,120 logic elements, 683 I/Os and approximately 5.22 Mbits of embedded memory, it targets designs that require substantial on-chip logic, I/O connectivity and embedded RAM within a surface-mount BGA form factor.

Key Features

• Core Logic  57,120 logic elements provide the programmable fabric for implementing complex digital logic and custom datapaths.
• Embedded Memory  Approximately 5.22 Mbits of on-chip RAM to support buffering, lookup tables and intermediate storage for streaming or packetized data.
• I/O Density  683 user I/Os enable high pin-count interfacing to peripherals, memory devices and board-level interconnects.
• Power  Specified core supply voltage range of 1.425 V to 1.575 V to match system power rails and support stable operation within that window.
• Package & Mounting  956-BBGA (40×40) ball-grid array, surface-mount package that optimizes board area for high-density designs.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0°C to 85°C suitable for standard embedded and consumer applications.
• Regulatory  RoHS compliant for use in lead-free manufacturing processes.

Typical Applications

• High-density digital systems  Implement complex control logic, finite state machines and custom processors using the device's large pool of logic elements and embedded memory.
• Data buffering and packet processing  On-chip RAM and plentiful I/Os support buffering, packet staging and protocol handling in communication or networking modules.
• Prototyping and development  Use the programmable fabric and abundant I/Os for rapid prototyping of digital designs and system-level validation before ASIC migration.
• Interface bridging  Leverage the high I/O count to implement protocol translators, bus bridges or custom interface logic between multiple subsystems.

Unique Advantages

• Substantial logic capacity: 57,120 logic elements allow integration of large digital functions on a single device, reducing external logic count.
• On-chip memory for system-level tasks: Approximately 5.22 Mbits of embedded RAM supports buffering and state storage without external memory.
• High I/O count: 683 I/Os enable direct connectivity to numerous peripherals and interfaces, simplifying board-level routing and component count.
• Compact BGA package: 956-BBGA (40×40) surface-mount package provides high pin density in a compact footprint for space-constrained designs.
• Commercial temperature range: Rated 0°C to 85°C to meet the needs of standard embedded and consumer product environments.
• RoHS compliant: Suitable for lead-free assembly and compliant manufacturing processes.

Why Choose EP1S60B956C6N?

The EP1S60B956C6N positions itself as a high-capacity Stratix® FPGA option for designs requiring a combination of abundant logic resources, significant embedded memory and a large number of I/Os in a compact BGA package. Its specification set supports integration of complex digital functionality and interface logic on a single device, helping reduce board-level components and simplify system architecture.

This FPGA is well suited to design teams building advanced embedded systems, communication interfaces and prototype platforms that benefit from on-chip RAM, high I/O density and a compact surface-mount package. The commercial-grade temperature rating and RoHS compliance support production deployment in a wide range of standard operating environments.

Request a quote or submit your requirements to receive pricing and availability for the EP1S60B956C6N.