EP1S60B956C7

IC FPGA 683 I/O 956BGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 683 956-BBGA

Quantity 12 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package956-BGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case956-BBGANumber of I/O683Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5712Number of Logic Elements/Cells57120
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5215104

Overview of EP1S60B956C7 – Stratix® FPGA, 683 I/O, 956-BBGA

The EP1S60B956C7 is a Stratix® field programmable gate array (FPGA) from Altera, offered in a 956-BBGA (956-BGA, 40×40) package for surface-mount applications. It provides a high-density programmable fabric with 57,120 logic elements and approximately 5.2 Mbits of embedded memory, paired with 683 user I/O pins for designs that require significant logic capacity and I/O integration.

Specified for commercial-grade deployments, the device operates from a core supply of 1.425 V to 1.575 V and across an ambient temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

  • Logic Capacity  57,120 logic elements provide a dense programmable fabric for complex digital designs and custom logic implementation.
  • Embedded Memory  Approximately 5.2 Mbits of on-chip RAM to support data buffering, local storage, and memory-intensive logic functions.
  • I/O Resources  683 user I/O pins to accommodate high-signal-count designs and extensive peripheral connectivity.
  • Power  Core voltage supply specified at 1.425 V to 1.575 V for consistent power planning and board-level design.
  • Package & Mounting  956-BBGA (956-BGA, 40×40) package in a surface-mount form factor to support compact PCB layouts and high pin density.
  • Grade & Environmental  Commercial-grade device with RoHS compliance; operating temperature range is 0 °C to 85 °C.

Typical Applications

  • High-density digital systems  Use the device where large amounts of programmable logic are needed to implement complex control and processing functions.
  • Multi-I/O controllers  Leverage 683 I/Os for designs that aggregate many interfaces, sensors, or external devices on a single FPGA.
  • Embedded memory–dependent designs  Take advantage of approximately 5.2 Mbits of on-chip RAM for local buffering, FIFOs, and data path storage.
  • Compact, surface-mount designs  The 956-BBGA package supports high pin-count implementations in space-constrained PCBs.

Unique Advantages

  • High logic integration: 57,120 logic elements reduce the need for multiple discrete ICs by consolidating complex logic into a single device.
  • Substantial on-chip RAM: Approximately 5.2 Mbits of embedded memory enables efficient local data handling and lowers external memory requirements.
  • Extensive I/O availability: 683 user I/Os allow broad interfacing options and simplify board-level routing for multi-signal systems.
  • Compact BGA package: The 956-BBGA (40×40) package offers a high pin count in a compact surface-mount footprint for dense PCB designs.
  • Commercial-grade and RoHS compliant: Suitable for commercial applications with environmental compliance for modern manufacturing.
  • Clear power specification: Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design and regulation choices.

Why Choose EP1S60B956C7?

The EP1S60B956C7 positions itself as a high-density Stratix® FPGA option for commercial applications that require significant logic resources, embedded memory, and a large number of I/Os in a compact surface-mount BGA package. Its combination of 57,120 logic elements, approximately 5.2 Mbits of on-chip RAM, and 683 I/Os makes it well suited to consolidate complex digital functions on a single device.

Choose this FPGA when your design priorities include integration, I/O count, and on-chip memory capacity, with clear power and temperature requirements suitable for commercial environments. The RoHS-compliant packaging supports modern assembly processes and regulatory expectations.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for EP1S60B956C7.

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