EP1S40F780C8

IC FPGA 615 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 615 3423744 41250 780-BBGA, FCBGA

Quantity 1,716 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O615Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1S40F780C8 – Stratix® FPGA, 41,250 logic elements, 780-FBGA

The EP1S40F780C8 is a Stratix® field programmable gate array (FPGA) by Intel (Altera) delivered in a 780-ball FCBGA package. It provides a high-density programmable fabric with 41,250 logic elements and approximately 3.42 Mbits of embedded memory for complex digital designs.

With 615 user I/O pins, on-chip clocking and DSP resources described in the Stratix device handbook, and a 1.425 V–1.575 V core supply window, this FPGA targets designs that require dense logic, substantial embedded memory, and extensive external interfacing within commercial temperature ranges.

Key Features

  • Logic Capacity  Provides 41,250 logic elements suitable for implementing complex state machines, datapaths, and custom logic functions.
  • Embedded Memory  Approximately 3.42 Mbits of on-chip RAM to support buffers, FIFOs, and local storage for data-intensive functions.
  • High I/O Count  615 user I/O pins enable dense external connectivity for multi-channel interfaces and parallel buses.
  • Clocking and DSP Resources  Architecture details in the Stratix device handbook describe PLLs, clock networks, multiplier blocks, and DSP block interfaces for synchronous and arithmetic-intensive designs.
  • Configuration & Debug  Supports industry-standard configuration and testing features documented in the Stratix handbook, including JTAG boundary-scan and SignalTap II embedded logic analysis, plus multiple configuration schemes and partial reconfiguration options.
  • Power Supply  Core voltage specified between 1.425 V and 1.575 V for predictable power planning and supply design.
  • Package & Mounting  780-ball BGA (FCBGA) package, supplier device package listed as 780-FBGA (29×29); surface-mount mounting for board-level integration.
  • Environmental & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-density digital processing  Implement complex finite-state machines and custom datapaths using the 41,250 logic elements and on-chip RAM.
  • Multi-channel I/O systems  Leverage 615 I/O pins for dense parallel interfaces, protocol bridging, and multi-lane capture/drive applications.
  • Embedded memory buffering  Use approximately 3.42 Mbits of embedded memory for packet buffering, frame storage, and local data manipulation.
  • Timing- and clock-sensitive designs  Employ the device’s documented PLLs and clock networks to manage complex clock domains and synchronous data paths.

Unique Advantages

  • High integration density: Consolidates substantial logic and memory on a single device to reduce board-level component count and simplify system architecture.
  • Extensive external connectivity: 615 I/O pins allow high-pin-count interfaces without external multiplexing, supporting richer system integration.
  • Flexible configuration and debug: Built-in support for JTAG boundary-scan and SignalTap II (per the Stratix handbook) accelerates bring-up and in-system debugging.
  • Documented architecture and tooling: Coverage in the Stratix device handbook details architecture blocks such as TriMatrix memory, multiplier blocks, PLLs, and configuration modes to aid design planning.
  • Commercial-grade and RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements for global manufacturability.

Why Choose EP1S40F780C8?

The EP1S40F780C8 delivers a balance of logic capacity, embedded memory, and high I/O count in a compact 780-ball FCBGA package, making it suitable for commercial designs that demand dense programmable logic and extensive external interfacing. Its documented Stratix architecture—covering clocking, DSP, memory modes, and configuration—helps shorten development time and supports complex system requirements.

This device is appropriate for design teams building high-density digital systems, multi-interface controllers, and memory-buffered datapaths who need a commercially graded FPGA backed by comprehensive device documentation and configuration features.

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