EP1S40F780C7

IC FPGA 615 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 615 3423744 41250 780-BBGA, FCBGA

Quantity 831 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O615Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1S40F780C7 – Stratix FPGA · 41,250 logic elements · ~3.423 Mbits RAM · 615 I/Os · 780-FBGA

The EP1S40F780C7 is a Stratix® field programmable gate array (FPGA) offered in a 780-ball FCBGA package designed for commercial applications. It integrates 41,250 logic elements, approximately 3.423 Mbits of on-chip RAM, and up to 615 I/O pins to support complex digital designs requiring dense logic, embedded memory, and extensive I/O connectivity.

Built on the Stratix device architecture, the device provides architectural building blocks such as logic array blocks, embedded memory structures, DSP/multiplier resources, and advanced clocking and I/O features described in the Stratix device handbook. The package, supply, and operating ranges make this device suitable for a wide range of commercial high-performance and high-density FPGA applications.

Key Features

  • Logic Capacity — 41,250 logic elements available for implementing complex state machines, datapaths, and control logic.
  • Embedded Memory — Approximately 3.423 Mbits of on-chip RAM, supporting multiple memory modes and flexible configuration for buffering, FIFOs, and lookup tables.
  • High I/O Count — 615 I/O pins to support broad external interfacing and parallel connectivity needs.
  • Advanced Architecture — Stratix architecture elements such as logic array blocks, multiplier/DSP resources, PLLs, and multi-track interconnect as detailed in the Stratix device handbook.
  • Configurable I/O and Interfaces — Device documentation includes support for a variety of I/O standards, double-data-rate interfaces, programmable drive strength, and on-chip termination options.
  • Configuration & Debug Support — Support for JTAG boundary-scan and embedded logic analysis/configuration flows are described in the device handbook.
  • Power & Supply — Core supply range from 1.425 V to 1.575 V for platform power planning and regulator selection.
  • Package & Mounting — 780-ball FCBGA (780-FBGA, 29×29) surface-mount package for high-density board integration.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C suitable for commercial environment deployments.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

  • High-speed Data Processing: Leverage the device’s dense logic array and on-chip memory for DSP kernels, packet processing, and data-path acceleration.
  • Communication Infrastructure: Use the high I/O count and advanced I/O capabilities for protocol bridging, framer/deframer blocks, and I/O-intense network functions.
  • Prototyping & Custom Logic: Ideal for hardware prototyping, FPGA-based emulation, and custom control logic that require substantial logic and memory resources.
  • Test & Measurement Systems: Combines ample logic, memory, and I/O to implement capture, analysis, and real-time processing functions in instrumentation platforms.

Unique Advantages

  • High Logic Density: 41,250 logic elements enable implementation of large, integrated digital systems on a single device, reducing board-level complexity.
  • Substantial On-Chip Memory: Approximately 3.423 Mbits of embedded RAM reduces dependence on external memory for buffering and low-latency storage.
  • Extensive I/O Resources: 615 I/Os provide flexible connectivity for parallel interfaces, multiple peripherals, and high-pin-count external devices.
  • Comprehensive Architectural Support: Stratix device handbook references for PLLs, DSP blocks, and configurable I/O give design teams documented primitives to accelerate integration.
  • Commercial Temperature & RoHS: 0 °C to 85 °C operating range and RoHS compliance simplify selection for mainstream commercial products and assemblies.
  • Compact, High-Density Package: 780-FBGA (29×29) surface-mount package offers a compact form factor for space-constrained PCBs while delivering extensive pinout options.

Why Choose EP1S40F780C7?

The EP1S40F780C7 positions itself as a high-capacity Stratix FPGA that balances dense logic, embedded memory, and a large I/O complement within a single 780-ball FCBGA package. It is suited for commercial designs requiring significant on-chip resources for data processing, interface integration, and custom hardware acceleration without moving to multiple devices.

Design teams benefit from the device’s documented Stratix architecture features—such as configurable memory modes, PLL/clock network descriptions, DSP interfaces, and I/O structure—allowing predictable integration and scalability within a development project supported by the device handbook and configuration options.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP1S40F780C7. Our team can provide ordering details and support information for incorporation into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up