EP20K200CF484I8
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA |
|---|---|
| Quantity | 1,224 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 376 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 832 | Number of Logic Elements/Cells | 8320 | ||
| Number of Gates | 526000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 106496 |
Overview of EP20K200CF484I8 – APEX-20KC® FPGA, 484-BBGA
The EP20K200CF484I8 is an Altera APEX-20KC® field programmable gate array (FPGA) supplied in a 484-BBGA surface-mount package. It combines a high I/O count and substantial on-chip resources to implement custom digital logic for industrial applications.
With 8,320 logic elements, approximately 0.106 Mbits of embedded RAM, 376 I/O pins and an industrial operating range, this device is designed for designs that require moderate-density programmable logic, extensive external interfacing, and reliable operation across -40 °C to 100 °C.
Key Features
- Core Logic: 8,320 logic elements and 526,000 equivalent gates provide programmable logic capacity for a broad range of custom digital functions.
- Configurable Logic Blocks: Structure supports flexible implementation of user logic while maintaining predictable resource counts for design planning.
- Embedded Memory: Approximately 106,496 bits (≈0.106 Mbits) of on-chip RAM to support buffers, FIFOs, and small data storage needs without external RAM.
- I/O Capacity: 376 I/O pins accommodate extensive external connectivity for sensors, peripherals, and high-channel-count interfaces.
- Package and Mounting: 484-BBGA (supplier package 484-FBGA, 23×23) surface-mount package for compact board-level integration.
- Power: Low-voltage core operation from 1.71 V to 1.89 V to match modern power-rail architectures.
- Temperature Range: Industrial-grade operation from -40 °C to 100 °C for use in demanding environments.
- Compliance: RoHS compliant for regulatory and environmental requirements.
Typical Applications
- Industrial Automation: Implement custom control logic and I/O aggregation for PLCs, motor control interfaces, and factory automation equipment.
- Embedded Systems: Provide glue logic, protocol bridging, and application-specific acceleration in embedded controller designs.
- Communications Interfaces: Support multi-channel I/O and data alignment tasks where configurable logic and large pin-count are required.
- Test and Measurement: Enable flexible signal handling, timing generation, and data buffering in instrumentation and test equipment.
Unique Advantages
- High Logic Density: 8,320 logic elements allow implementation of complex, custom logic without immediate need for external CPLDs or discrete logic.
- Large I/O Count: 376 I/O pins simplify board-level connectivity and reduce the need for external multiplexers or expanders.
- Industrial Temperature Rating: Rated from -40 °C to 100 °C for dependable operation in industrial environments.
- Compact Ball Grid Package: 484-BBGA surface-mount packaging supports high-density PCB layouts while maintaining robust electrical connections.
- Low-Voltage Core: 1.71–1.89 V supply supports integration with modern low-voltage power architectures.
- Regulatory Compliance: RoHS compliance aligns with contemporary environmental and supply-chain requirements.
Why Choose EP20K200CF484I8?
The EP20K200CF484I8 positions itself as a versatile mid-density FPGA option within the APEX-20KC family, offering a balance of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployments in demanding environments where reliability and regulatory alignment matter.
This device is well suited for engineers designing industrial controllers, embedded platforms, communications interfaces, and test equipment who need predictable resource counts, extensive external connectivity, and surface-mount packaging for compact board designs.
Request a quote or submit an inquiry to obtain pricing and availability for EP20K200CF484I8 and to discuss lead times and ordering options.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018