EP20K200CF484C8ES

The EP20K200CF484C8ES is an APEX-20KC family FPGA in a 484-BBGA package designed for commercial embedded and logic‑intensive applications. It implements a MultiCore architecture combining look-up table (LUT) logic and embedded memory to support register‑intensive functions and memory structures such as FIFOs and dual‑port RAM.

With a high gate count, abundant logic elements, and integrated I/O flexibility, this device is targeted at designers needing dense programmable logic, integrated memory resources, and controlled power on a surface‑mount BBGA footprint.

Key Features

• Core Logic — 8,320 logic elements (LEs) providing the programmable logic resources required for complex control and glue logic implementations.
• Gate Density — Up to 526,000 system gates as specified for the EP20K200C device, enabling sizeable logic integration on a single device.
• Embedded Memory — Approximately 0.106 Mbits of on‑chip RAM (106,496 total RAM bits) for FIFOs, buffers, and small data storage without consuming LE resources.
• I/O Capacity — 376 user I/O pins supporting MultiVolt interfaces and a wide range of external memory and peripheral connections.
• Clock Management — Integrated clock features including up to two PLLs (as specified for EP20K200C) and a built‑in low‑skew clock tree for multi‑domain clocking.
• Power — Internal supply operation around 1.8 V with a specified operating supply range of 1.71 V to 1.89 V and low‑power copper interconnect design.
• Package & Mounting — 484‑BBGA (484‑FBGA 23×23 supplier package) surface‑mount package suitable for compact board designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for commercial applications.

Typical Applications

• Commercial embedded systems — Implement control logic, protocol bridging, and custom data paths where integrated memory and dense logic reduce external component count.
• Memory interface and buffering — Use on‑chip RAM and embedded system blocks for FIFOs and dual‑port RAM to support external memory timing and buffering requirements.
• High‑density glue logic — Consolidate glue logic, bus interfacing, and custom peripherals into a single FPGA to simplify board design and shorten development cycles.

Unique Advantages

• Integrated logic and memory: 8,320 logic elements combined with approximately 0.106 Mbits of embedded RAM reduce reliance on external SRAM/DRAM for small buffers and control storage.
• Substantial gate capacity: Up to 526,000 system gates enables consolidation of multiple discrete functions into one programmable device, lowering BOM complexity.
• Flexible I/O count: 376 user I/O pins support diverse interface requirements and simplify connection to external devices and memories.
• On‑chip clock resources: Dedicated PLLs and a low‑skew clock tree make multi‑domain timing and clock distribution easier to implement.
• Compact board footprint: 484‑BBGA surface‑mount package offers a high pin density for space‑constrained commercial products.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose EP20K200CF484C8ES?

The EP20K200CF484C8ES is positioned for designers who need a commercially graded FPGA that balances dense programmable logic, embedded RAM, and substantial I/O capacity in a compact BBGA package. Its MultiCore architecture and integrated clock features provide targeted capabilities for register‑intensive logic and memory‑centric functions without increasing board complexity.

For development teams building commercial embedded systems, protocol interfaces, or consolidated control logic, this device delivers a scalable, RoHS‑compliant platform with clear electrical and thermal limits to support reliable deployment in 0 °C to 85 °C operating environments.

Request a quote or submit an inquiry today to learn about availability and lead times for the EP20K200CF484C8ES and how it can fit into your next design.