EP20K200CF484C7

IC FPGA 376 I/O 484FBGA
Part Description

APEX-20KC® Field Programmable Gate Array (FPGA) IC 376 106496 8320 484-BBGA

Quantity 27 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O376Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits106496

Overview of EP20K200CF484C7 – APEX-20KC Field Programmable Gate Array (FPGA), 484‑BBGA

The EP20K200CF484C7 is an APEX‑20KC family FPGA offered in a 484‑BBGA package (484‑FBGA, 23×23). It integrates MultiCore architecture with look‑up table (LUT) logic and embedded memory blocks to deliver mid‑density programmable logic for system and I/O‑intensive designs. Key technical characteristics include 8,320 logic elements, approximately 106,496 bits of embedded RAM, 376 user I/O pins, and support for MultiVolt I/O signaling and high‑speed memory interfaces.

Built on a 0.15‑µm copper‑metal fabrication process, this device provides a balance of performance and power efficiency for commercial‑grade applications operating from 0 °C to 85 °C with an internal supply range of 1.71 V to 1.89 V.

Key Features

  • Core Logic 8,320 logic elements and up to 526,000 system gates, delivering mid‑range capacity for control, processing, and glue‑logic functions.
  • Embedded Memory Approximately 106,496 bits of on‑chip RAM implemented in embedded system blocks (ESBs) suitable for FIFOs, dual‑port RAM, and CAM functions.
  • I/O and Interface Support 376 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces; support for advanced standards including LVDS channels, PCI (3.3 V), DDR SDRAM and ZBT SRAM interfaces.
  • Clock Management Up to 2 phase‑locked loops (PLLs) with features such as ClockLock, ClockBoost, and ClockShift, plus up to eight global clock signals and a built‑in low‑skew clock tree.
  • Advanced Interconnect Four‑level FastTrack hierarchical interconnect, dedicated carry and cascade chains, and interleaved local interconnect for predictable, high‑performance routing.
  • Process and Power 0.15‑µm copper‑metal process reduces power consumption; designed for low‑power operation with a nominal internal supply around 1.8 V.
  • Package and Mounting Surface mount 484‑BBGA (supplier package noted as 484‑FBGA, 23×23) for compact board integration.
  • Commercial Grade and Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • High‑speed memory interfaces — Implement DDR SDRAM and ZBT SRAM controllers and buffering using the device’s ESBs and MultiVolt I/O support.
  • PCI‑based systems — Use the device’s 3.3 V PCI support and flexible I/O for PCI local bus implementations at 33/66 MHz.
  • Multi‑lane serial and parallel I/O — Deploy LVDS channels and abundant user I/O for high‑speed data links, board‑level bridging, and interface consolidation.
  • Embedded system logic — Integrate control, glue logic, FIFOs and memory structures on a single device to simplify board design.

Unique Advantages

  • Balanced mid‑range capacity: 8,320 logic elements and approximately 526,000 gates provide substantial programmable resources without the cost and power of larger devices.
  • On‑chip memory integration: Approximately 106,496 bits of embedded RAM in ESBs reduce external memory dependency for buffering and data management.
  • Versatile I/O and interface flexibility: 376 user I/Os with MultiVolt support and a range of supported interface standards simplify system interoperability.
  • Deterministic clocking: Multiple PLLs, low‑skew clock tree, and dedicated clock features help achieve reliable synchronous performance for complex designs.
  • Power‑aware process: Copper interconnect and a nominal 1.8 V internal supply help lower power consumption for commercial applications.
  • Design ecosystem support: Architecture supported by vendor design tools and megafunction libraries to accelerate development and place‑and‑route.

Why Choose EP20K200CF484C7?

The EP20K200CF484C7 targets designers who need a reliable, mid‑density FPGA that combines substantial logic resources with embedded RAM and a rich set of I/O features. Its MultiCore LUT architecture, dedicated carry/cascade chains and advanced interconnect make it suitable for systems requiring predictable timing and integrated memory functionality.

For commercial‑grade applications that require MultiVolt I/O, high‑speed memory interfaces, and on‑chip buffering while maintaining a compact 484‑BBGA footprint, this APEX‑20KC device offers an effective balance of performance, integration, and power efficiency supported by established vendor tools and megafunction libraries.

Request a quote or submit a purchase inquiry to learn more about availability, pricing, and lead times for EP20K200CF484C7.

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