EP20K200BC356-3

The EP20K200BC356-3 is an APEX-20K series FPGA offering a MultiCore architecture with LUT-based logic and embedded system blocks (ESBs) for integrated memory and product-term functions. It provides a balance of logic density, on-chip memory, and flexible I/O suitable for commercial embedded designs.

Designed for system integration tasks, the device targets applications that require programmable logic, embedded RAM, and a variety of high-performance I/O options while operating within commercial temperature and supply ranges.

Key Features

• Core architecture  MultiCore architecture combining look-up table (LUT) logic and product-term logic to support register-intensive and combinatorial functions.
• Logic resources  8,320 logic elements and approximately 526,000 system gates to implement medium-density logic functions.
• Embedded memory  Approximately 0.106 Mbits of embedded memory (106,496 bits) for FIFOs, dual-port RAM and CAM implementations using ESBs.
• I/O and package  277 user I/O pins in a 356-LBGA (356-BGA, 35×35) package for dense board-level integration and flexible interfacing.
• Clock management  On-chip clock management features described in the APEX-20K family, including support for up to four PLLs, a low-skew clock tree, and multiple global clocks for deterministic timing control.
• MultiVolt I/O support  Architecture-level MultiVolt I/O support enabling interfacing across common I/O voltage domains as described for the APEX-20K family.
• Power and supply  Voltage supply range listed at 2.375 V to 2.625 V for device operation; family-level features include low-power design options and programmable ESB power-saving modes.
• Commercial temperature grade  Specified for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Typical Applications

• High-speed memory interfaces  Implement DDR SDRAM or other external-memory controllers using the device’s embedded memory blocks and I/O capabilities.
• Peripheral and bus bridging  PCI Local Bus interfacing and peripheral glue logic where programmable I/O and timing control are required.
• Data acquisition and signal processing  On-chip LUTs, ESBs and clock management enable buffering, FIFO staging and logic for real-time data paths.
• System-on-a-programmable-chip (SOPC) integration  Use the device’s MultiCore architecture and embedded system blocks to consolidate functions and reduce external components.

Unique Advantages

• Integrated logic and memory: 8,320 logic elements combined with approximately 0.106 Mbits of embedded RAM reduce the need for external memory in many designs.
• Flexible I/O in a compact package: 277 user I/O pins in a 356-LBGA (35×35) package enable dense routing and board-space-efficient solutions.
• Clocking and timing control: Family-level PLL and clock-tree features provide configurable clock domains and reduced skew for deterministic system timing.
• Commercial-ready thermal range: Specified for 0 °C to 85 °C operation, making it suitable for a wide range of non-industrial, commercial electronic products.
• RoHS compliant: Environmentally compliant manufacturing status supports regulatory requirements for commercial products.

Why Choose EP20K200BC356-3?

The EP20K200BC356-3 delivers a practical combination of logic density, embedded memory, and configurable I/O in a compact 356-LBGA package, making it well-suited to commercial embedded and system integration tasks. Its MultiCore architecture and ESBs enable designers to consolidate buffering, memory, and product-term logic on-chip, simplifying board-level design.

This device is appropriate for engineering teams developing memory interfaces, bus bridging, data acquisition, or SOPC-style integration where a balance of resources, package density, and commercial-grade operating conditions are required. Its documented family features and compliance profile support predictable integration into production designs.

If you would like pricing, availability, or to request a quote for EP20K200BC356-3, please submit a quote request or contact sales for further assistance.