EP20K200BC484-1X

IC FPGA 382 I/O 484FBGA
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 382 106496 8320 484-BBGA

Quantity 978 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O382Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs832Number of Logic Elements/Cells8320
Number of Gates526000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits106496

Overview of EP20K200BC484-1X – APEX-20K Field Programmable Gate Array (FPGA), 484-BBGA

The EP20K200BC484-1X is an APEX-20K family FPGA in a 484-ball BGA package designed for configurable logic and embedded memory integration. It implements the APEX MultiCore architecture with lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs), enabling SOPC-style integration of logic, memory and I/O functions.

With 8,320 logic elements, approximately 106 kbits of embedded memory and 382 I/Os in a surface-mount 484-BBGA package, this commercial-grade FPGA targets designs requiring dense on-chip logic, flexible I/O and on-chip buffering within a 0 °C to 85 °C operating range.

Key Features

  • Core Architecture  MultiCore APEX-20K architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for combining register-intensive and memory/combination-intensive functions.
  • Logic Capacity  8,320 logic elements (LEs) and a maximum of 526,000 system gates equivalent provide substantial programmable logic resources for mid-density designs.
  • Embedded Memory  Approximately 106,496 bits of on-chip RAM provided by ESBs for FIFOs, dual-port RAM and content-addressable memory implementations.
  • I/O and Interfaces  382 user I/Os supporting a broad range of external interface needs and direct connection to local interconnect for low-latency pin-to-logic paths.
  • Clock and Timing  Flexible clock-management features in the APEX-20K family (including multiple PLLs and low-skew clock tree) support complex clocking requirements.
  • Power and I/O Voltage  Device supply range specified at 2.375 V to 2.625 V with MultiVolt I/O support indicated in the APEX-20K family documentation for interfacing varied I/O voltage domains.
  • Package and Mounting  Surface-mount 484-BBGA (supplier package: 484-FBGA, 23×23) for high-density board placement and reliable solder attach.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial applications.
  • RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

  • Embedded System Integration  Implement SOPC-style system functions by combining LUT logic and ESB memory to consolidate logic and buffering on-chip.
  • Memory Interface and Buffering  Use the on-chip ESB RAM for FIFOs and dual-port RAM to support high-speed external memory interfaces and data buffering architectures.
  • High-density Logic Implementation  Deploy the 8,320 logic elements for mid-density custom logic, protocol processing and glue-logic consolidation.
  • I/O-Intensive Designs  Leverage 382 user I/Os for complex peripheral interfacing and multi-voltage I/O domain connectivity.

Unique Advantages

  • Integrated SOPC-capable Architecture: Combines LUTs, product-term logic and ESBs to reduce external memory and glue logic requirements.
  • Substantial On-chip Memory: Approximately 106 kbits of embedded RAM enables on-chip FIFOs and buffering for latency-sensitive datapaths.
  • Generous I/O Count: 382 user I/Os provide flexibility for multi-device interfaces and board-level consolidation.
  • Proven APEX-20K Feature Set: Family-level clock management and interconnect features support predictable timing and complex clock topologies.
  • Compact BGA Package: 484-BBGA surface-mount package facilitates high-density PCB layouts while maintaining robust electrical connections.
  • RoHS Compliant: Environmentally compliant manufacturing for regulated product builds.

Why Choose EP20K200BC484-1X?

The EP20K200BC484-1X positions itself as a mid-density APEX-20K FPGA suited for designs that require a balanced combination of logic elements, embedded memory and a high I/O count. Its MultiCore architecture and ESB-based memory make it appropriate for consolidating logic, buffering and interface functions within a single device.

This device is well matched to commercial applications that need configurable logic and embedded RAM in a compact 484-BBGA package, offering a reliable platform for developers who value integration, flexible I/O and family-level clocking and interconnect features documented for the APEX-20K series.

Request a quote or submit a pricing inquiry to receive availability and purchasing information for the EP20K200BC484-1X. Our team can provide lead-time and volume pricing details to support your design cycle.

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