EP2C5Q208I8
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 142 119808 4608 208-BFQFP |
|---|---|
| Quantity | 1,633 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 288 | Number of Logic Elements/Cells | 4608 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 119808 |
Overview of EP2C5Q208I8 – Cyclone® II FPGA, 4608 logic elements, 208-BFQFP
The EP2C5Q208I8 is a Cyclone II field-programmable gate array (FPGA) in a 208-BFQFP surface-mount package. It implements the Cyclone II architecture and provides a balance of configurable logic, on-chip memory, and I/O for compact embedded and DSP-focused designs.
Designed for industrial applications, the device operates from a 1.15 V to 1.25 V core supply and across an extended temperature range of −40 °C to 100 °C, with RoHS-compliant construction.
Key Features
- Logic Capacity Provides 4,608 logic elements suitable for implementing control, glue-logic, and medium-density processing functions.
- On-Chip Memory Approximately 0.12 Mbits (119,808 bits) of embedded RAM for buffering, FIFOs, and small local storage.
- I/O Resources 142 available I/O pins to support a variety of peripheral interfaces and external signaling.
- Core Supply Voltage Operates from 1.15 V to 1.25 V, enabling standard Cyclone II core-level power domains.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for use in industrial environments.
- Package & Mounting 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm), surface-mount assembly for compact board designs.
- Standards & Documentation Part of the Cyclone II family with device handbook material covering architecture, configuration, I/O structure, PLLs, embedded memory, and on-chip multipliers.
- Compliance RoHS-compliant construction.
Typical Applications
- Low-cost embedded processing Implements control and processing functions for cost-sensitive embedded systems as described for Cyclone II devices.
- Low-cost DSP solutions Supports DSP-oriented implementations using the Cyclone II architecture's embedded resources.
- External memory interfacing Suitable for designs that require external memory interfaces, leveraging the device's I/O and memory architecture.
- Industrial control systems Industrial-grade temperature rating and robust packaging make it applicable to factory and process control electronics.
Unique Advantages
- Configurable logic density: 4,608 logic elements provide flexible implementation options for medium-complexity designs.
- On-chip embedded memory: Approximately 0.12 Mbits of RAM reduces external memory dependency for small buffers and state storage.
- Rich I/O count: 142 I/O pins support broad peripheral connectivity and interface routing on compact boards.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
- Low-voltage core operation: 1.15 V–1.25 V supply aligns with Cyclone II core power domains for efficient designs.
- Compact surface-mount package: 208-BFQFP (28 × 28 mm) balances board-area efficiency with routing capability for PCB designs.
Why Choose EP2C5Q208I8?
The EP2C5Q208I8 offers a practical combination of configurable logic, embedded memory, and plentiful I/O in the Cyclone II architecture, making it suited to medium-density embedded and DSP applications that require industrial temperature capability. Its surface-mount 208-BFQFP package and RoHS compliance facilitate integration into modern production assemblies.
This device is appropriate for teams needing a documented Cyclone II solution—supported by Cyclone II device handbook material covering architecture, configuration, PLLs, embedded memory, and I/O—while maintaining predictable supply-voltage and temperature specifications.
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