EP2C8T144C6N

The EP2C8T144C6N is an Intel Cyclone® II FPGA in a 144‑LQFP surface‑mount package. It implements the Cyclone II architecture and provides on‑device logic, embedded memory, and I/O resources intended for low‑cost embedded processing and DSP-oriented designs.

With 8,256 logic elements, approximately 0.166 Mbits of embedded RAM, 85 I/O pins, and a defined 1.15 V–1.25 V supply range, this commercial‑grade device is suited to compact board designs that require configurable logic and integrated on‑chip resources within a 0 °C to 85 °C operating window. The device is RoHS compliant.

Key Features

• Core Logic  8,256 logic elements provide a flexible fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 165,888 bits (≈0.166 Mbits) of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity  85 I/O pins suitable for peripheral interfaces, sensor connections, and board‑level signaling.
• Power Supply  Operates from 1.15 V to 1.25 V, enabling use in systems with a low‑voltage core rail.
• Package & Mounting  144‑LQFP surface‑mount package (supplier package: 144‑TQFP, 20×20) for compact PCB layouts.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Cyclone II Architecture Elements  The Cyclone II device family includes architectural features such as global clock networks, phase‑locked loops (PLLs), embedded multipliers, and M4K memory blocks (as documented in the Cyclone II Device Handbook).
• Compliance  RoHS compliant.

Typical Applications

• Low‑Cost Embedded Processing  Configurable logic and on‑chip RAM enable simple embedded processing tasks and glue logic in cost‑sensitive systems.
• Low‑Cost DSP Functions  Cyclone II architectural elements such as embedded multipliers and PLLs support basic DSP and signal‑processing functions.
• I/O Aggregation & Interface Bridging  The device’s I/O count and programmable fabric are suitable for consolidating peripheral interfaces and implementing protocol bridges.
• Prototyping & Custom Logic  Compact package and commercial temperature rating make the device appropriate for board‑level prototyping and production designs requiring custom finite state machines and control logic.

Unique Advantages

• Integrated Logic and Memory: Combines 8,256 logic elements with on‑chip RAM to reduce external component count for many control and buffering tasks.
• Architecture‑Level DSP Support: Cyclone II family features such as embedded multipliers and PLLs (documented in the device handbook) enable implementing arithmetic and timing‑sensitive blocks on‑chip.
• Compact Surface‑Mount Package: 144‑LQFP (20×20 supplier package) simplifies PCB layout for space‑constrained designs while keeping signals accessible.
• Tight Supply Window: Defined 1.15 V–1.25 V operating supply range supports consistent core‑level power management in modern board designs.
• Clear Commercial Specification: Commercial grade with 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.

Why Choose EP2C8T144C6N?

The EP2C8T144C6N delivers a balanced combination of configurable logic, embedded memory, and I/O in a compact 144‑LQFP package. It aligns with Cyclone II device family capabilities described in the Cyclone II Device Handbook, offering architectural elements useful for embedded processing and DSP‑oriented designs while maintaining a clear commercial temperature and supply specification.

This device is well suited for engineers and procurement teams designing cost‑constrained, space‑limited systems that require on‑board programmability, moderate logic density, and integrated memory resources with predictable supply and temperature requirements.

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