EP2C8Q208I8N

The EP2C8Q208I8N is an Intel Cyclone® II field programmable gate array provided in a 208-pin BFQFP package for surface-mount assembly. It is a Cyclone II family device designed for low-cost embedded processing and DSP-oriented designs within industrial temperature ranges.

Built on Cyclone II architecture, this device combines 8,256 logic elements with embedded memory and a comprehensive I/O complement to support compact, low-voltage FPGA designs that require flexible interfacing and moderate logic density.

Key Features

• Logic Capacity  8,256 logic elements supporting common Cyclone II logic element modes and routing structures.
• Embedded Memory  Approximately 0.166 Mbits (165,888 bits) of on-chip RAM for data buffering, FIFOs, and small on-chip storage.
• I/O Resources  138 I/O pins to support diverse external interfaces and signalling options.
• Cyclone II Architecture  Device family features documented in the Cyclone II handbook, including global clock networks, PLLs, embedded multipliers, and dedicated memory blocks.
• Power  Core supply range of 1.15 V to 1.25 V for low-voltage operation.
• Package & Mounting  208-BFQFP (208-PQFP 28×28) surface-mount package for space-efficient board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Compliance  RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Embedded Processing Systems  Low-cost embedded processing applications where programmable logic and on-chip memory enable customized control and integration.
• Digital Signal Processing  DSP-oriented designs that leverage Cyclone II architecture features such as embedded multipliers and memory for signal filtering and transforms.
• Memory and Interface Bridging  External memory interfacing and protocol conversion tasks that benefit from the device’s I/O count and Cyclone II routing resources.
• Industrial Control  Industrial automation and control functions that require operation across −40 °C to 100 °C and demand reliable programmable logic capacity.

Unique Advantages

• Balanced Logic and Memory  Combines 8,256 logic elements with approximately 0.166 Mbits of embedded RAM to support mixed-control and buffering functions on a single device.
• Extensive I/O for Integration  138 I/Os provide flexibility for connecting sensors, memory, and peripheral interfaces without immediate need for additional devices.
• Low-Voltage Core Operation  1.15 V to 1.25 V core supply reduces power envelope and aligns with low-voltage board domains.
• Industrial Temperature Capability  Rated −40 °C to 100 °C for deployment in temperature-challenging industrial environments.
• Surface-Mount, Compact Package  208-BFQFP package supports compact board layouts while maintaining pin count for complex interfacing.
• Standards and Compliance  RoHS compliance supports regulatory and environmental requirements for commercial and industrial products.

Why Choose EP2C8Q208I8N?

The EP2C8Q208I8N positions itself as a practical Cyclone II FPGA option for designers needing a balanced mix of logic density, on-chip memory, and generous I/O in a compact surface-mount package. Its Cyclone II architecture foundations—documented features such as global clock networks, PLLs, embedded multipliers, and dedicated memory blocks—support flexible implementation of embedded processing and DSP functions.

This device is well suited to engineering teams targeting industrial applications that require operation across a wide temperature range and adherence to RoHS. The combination of voltage, package, and resource set makes it appropriate for space-constrained boards where integration and reliable operation are key priorities.

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