EP2C8Q208C8

The EP2C8Q208C8 is a Cyclone® II FPGA from Intel, featuring 8,256 logic elements and approximately 0.166 Mbits of embedded memory. It is a commercial-grade, surface-mount FPGA in a 208-BFQFP (28×28) package with 138 I/O pins and a nominal core voltage range of 1.15 V to 1.25 V.

Designed for low-cost embedded processing and DSP-focused designs, this device targets applications that require moderate logic capacity, on-chip RAM, flexible I/O and integrated clocking resources while operating across a commercial 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  8,256 logic elements suitable for mid-range embedded and control logic implementations.
• On-Chip Memory  Approximately 0.166 Mbits of embedded RAM (165,888 total RAM bits) for data buffering, FIFOs, and small memory-intensive functions.
• I/O Resources  138 I/O pins provided in the 208-BFQFP package to support a variety of peripheral interfaces and external devices.
• Clocking and PLLs  Integrated global clock network and phase-locked loops (PLLs) as described in the Cyclone II device handbook for flexible clock management and distribution.
• Embedded DSP Support  On-device embedded multipliers and DSP-oriented resources documented in the Cyclone II handbook for signal-processing tasks.
• I/O Feature Set  Support for advanced I/O standards, differential interfaces, programmable drive strength, slew-rate control, bus-hold, programmable pull-ups and series on-chip termination as detailed in the device handbook.
• Power and Package  Surface-mount 208-BFQFP (28×28) package with a specified voltage supply range of 1.15 V to 1.25 V for core operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Low-Cost Embedded Processing  Implement controllers, state machines and protocol bridges that benefit from on-chip logic and memory.
• DSP and Signal Processing  Use embedded multipliers and RAM for moderate DSP tasks such as filtering, sample buffering and arithmetic acceleration.
• Interface and Bus Bridging  Leverage 138 I/Os and flexible I/O features for external memory interfaces, serial/deserializer links and mixed-signal front-ends.
• Custom Logic in Consumer and Commercial Products  Integrate application-specific control, timing and glue logic in commercial temperature applications.

Unique Advantages

• Balanced Logic and Memory:  8,256 logic elements paired with approximately 0.166 Mbits of embedded RAM provide a practical balance for mid-range designs without external SRAM in many cases.
• Versatile I/O Capability:  138 I/O pins and on-chip I/O features enable flexible interface design and signal-conditioning choices directly on the FPGA.
• Integrated Clocking:  Global clock network and PLLs enable robust clock distribution and frequency management for synchronous designs.
• Compact Surface-Mount Package:  208-BFQFP (28×28) package supports dense board layouts while maintaining a high pin count for connectivity.
• Commercial Temperature and RoHS Compliant:  Rated for 0 °C to 85 °C operation and RoHS compliance for commercial product deployments.
• Documented Design Guidance:  Supported by the Cyclone II Device Handbook and related documentation for architecture, I/O, timing and configuration details.

Why Choose EP2C8Q208C8?

The EP2C8Q208C8 Cyclone II FPGA delivers a mid-range mix of logic, embedded memory and I/O resources in a compact 208-BFQFP surface-mount package, suitable for commercial embedded and DSP-focused designs. Its integrated clocking, embedded multipliers and documented I/O features make it a practical option for designers looking to consolidate functionality and reduce external components.

With Intel’s Cyclone II device documentation available for design and configuration, the EP2C8Q208C8 is well-suited to teams seeking a documented, commercially graded FPGA platform for prototyping and production where the specified voltage and temperature ranges meet system requirements.

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