EP2C8F256I8N

IC FPGA 182 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA

Quantity 446 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs516Number of Logic Elements/Cells8256
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of EP2C8F256I8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA

The EP2C8F256I8N is an Intel Cyclone® II family FPGA offering a balanced mix of logic capacity, on-chip memory and flexible I/O in a compact 256-LBGA package. Built on the Cyclone II architecture, the device targets low-cost embedded processing and DSP-oriented designs that require moderate programmable logic, embedded memory and a broad set of I/O resources.

With 8,256 logic elements, approximately 0.166 Mbits of embedded RAM, 182 I/O pins and an industrial temperature grade, this device is suited to applications that need reliable operation across −40 °C to 100 °C and a low-voltage core supply of 1.15 V–1.25 V.

Key Features

  • Cyclone II architecture  Includes the Cyclone II device family features such as global clock networks, PLLs, embedded multipliers and a flexible I/O structure to support a range of design topologies.
  • Logic capacity  8,256 logic elements provide the programmable logic resources for control, glue logic, custom peripherals and moderate DSP functions.
  • Embedded memory  Approximately 0.166 Mbits of total on-chip RAM for FIFOs, buffering and small data storage requirements.
  • I/O resources  182 I/O pins enable broad external interfacing and board-level connectivity for sensors, memory interfaces and peripherals.
  • Voltage and power domain  Low-voltage core supply range of 1.15 V to 1.25 V to match platform power architectures.
  • Industrial temperature grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Package  256-LBGA supplier package (256-FBGA, 17×17) for compact board integration and high pin density.
  • Surface-mount mounting  Standard surface-mount package suitable for automated PCB assembly.

Typical Applications

  • Embedded processing  Implement compact microcontroller offloads, custom peripherals and control logic using the Cyclone II architecture and on-chip RAM.
  • Low-cost DSP functions  Perform signal processing tasks and data path acceleration leveraging embedded multipliers and the device’s logic capacity.
  • Industrial control and automation  Use the device’s industrial temperature rating and plentiful I/O for motor control, sensor interfacing and machine control logic.
  • Interface bridging and glue logic  Manage protocol translation and board-level interfacing where moderate logic density and many I/O are required.

Unique Advantages

  • Right-sized logic for mid-range designs: 8,256 logic elements provide enough capacity for complex glue logic, peripheral control and moderate DSP without excessive area or power overhead.
  • On-chip RAM for buffering: Approximately 0.166 Mbits of embedded memory simplifies small FIFO and buffer implementations and reduces external memory dependency.
  • Extensive I/O count: 182 I/O pins allow flexible connections to sensors, memories and peripherals, minimizing external multiplexing.
  • Industrial-grade operation: Specified operation from −40 °C to 100 °C supports deployment in demanding temperature environments.
  • Compact LBGA package: The 256-LBGA (17×17) package delivers high pin density in a small footprint for space-constrained designs.
  • Established device family documentation: The Cyclone II family handbook and device datasheet provide detailed architecture, timing and configuration information to support development and validation.

Why Choose EP2C8F256I8N?

The EP2C8F256I8N combines a balanced logic element count, embedded memory and a high I/O count in a compact 256-LBGA package, making it a practical choice for mid-range embedded and DSP-focused designs that require industrial temperature capability and a low-voltage core supply. Its inclusion in the Cyclone II device family means designers can rely on comprehensive documentation and architecture-level features such as PLLs, embedded multipliers and flexible I/O support.

This device is well suited to engineers and procurement teams looking for a dependable, documented FPGA option for control, interfacing and moderate signal-processing tasks where board area, I/O density and operating temperature range are important selection factors.

Request a quote or submit a pricing and availability inquiry to evaluate EP2C8F256I8N for your next design.

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