EP2C8F256I8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA |
|---|---|
| Quantity | 446 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 516 | Number of Logic Elements/Cells | 8256 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of EP2C8F256I8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA
The EP2C8F256I8N is an Intel Cyclone® II family FPGA offering a balanced mix of logic capacity, on-chip memory and flexible I/O in a compact 256-LBGA package. Built on the Cyclone II architecture, the device targets low-cost embedded processing and DSP-oriented designs that require moderate programmable logic, embedded memory and a broad set of I/O resources.
With 8,256 logic elements, approximately 0.166 Mbits of embedded RAM, 182 I/O pins and an industrial temperature grade, this device is suited to applications that need reliable operation across −40 °C to 100 °C and a low-voltage core supply of 1.15 V–1.25 V.
Key Features
- Cyclone II architecture Includes the Cyclone II device family features such as global clock networks, PLLs, embedded multipliers and a flexible I/O structure to support a range of design topologies.
- Logic capacity 8,256 logic elements provide the programmable logic resources for control, glue logic, custom peripherals and moderate DSP functions.
- Embedded memory Approximately 0.166 Mbits of total on-chip RAM for FIFOs, buffering and small data storage requirements.
- I/O resources 182 I/O pins enable broad external interfacing and board-level connectivity for sensors, memory interfaces and peripherals.
- Voltage and power domain Low-voltage core supply range of 1.15 V to 1.25 V to match platform power architectures.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Package 256-LBGA supplier package (256-FBGA, 17×17) for compact board integration and high pin density.
- Surface-mount mounting Standard surface-mount package suitable for automated PCB assembly.
Typical Applications
- Embedded processing Implement compact microcontroller offloads, custom peripherals and control logic using the Cyclone II architecture and on-chip RAM.
- Low-cost DSP functions Perform signal processing tasks and data path acceleration leveraging embedded multipliers and the device’s logic capacity.
- Industrial control and automation Use the device’s industrial temperature rating and plentiful I/O for motor control, sensor interfacing and machine control logic.
- Interface bridging and glue logic Manage protocol translation and board-level interfacing where moderate logic density and many I/O are required.
Unique Advantages
- Right-sized logic for mid-range designs: 8,256 logic elements provide enough capacity for complex glue logic, peripheral control and moderate DSP without excessive area or power overhead.
- On-chip RAM for buffering: Approximately 0.166 Mbits of embedded memory simplifies small FIFO and buffer implementations and reduces external memory dependency.
- Extensive I/O count: 182 I/O pins allow flexible connections to sensors, memories and peripherals, minimizing external multiplexing.
- Industrial-grade operation: Specified operation from −40 °C to 100 °C supports deployment in demanding temperature environments.
- Compact LBGA package: The 256-LBGA (17×17) package delivers high pin density in a small footprint for space-constrained designs.
- Established device family documentation: The Cyclone II family handbook and device datasheet provide detailed architecture, timing and configuration information to support development and validation.
Why Choose EP2C8F256I8N?
The EP2C8F256I8N combines a balanced logic element count, embedded memory and a high I/O count in a compact 256-LBGA package, making it a practical choice for mid-range embedded and DSP-focused designs that require industrial temperature capability and a low-voltage core supply. Its inclusion in the Cyclone II device family means designers can rely on comprehensive documentation and architecture-level features such as PLLs, embedded multipliers and flexible I/O support.
This device is well suited to engineers and procurement teams looking for a dependable, documented FPGA option for control, interfacing and moderate signal-processing tasks where board area, I/O density and operating temperature range are important selection factors.
Request a quote or submit a pricing and availability inquiry to evaluate EP2C8F256I8N for your next design.

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