EP2C8F256C8

IC FPGA 182 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 182 165888 8256 256-LBGA

Quantity 791 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs516Number of Logic Elements/Cells8256
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of EP2C8F256C8 – Cyclone® II Field Programmable Gate Array (FPGA) IC, 8,256 Logic Elements, 256-LBGA

The EP2C8F256C8 is a Cyclone® II family FPGA delivering 8,256 logic elements and approximately 0.16 Mbits of embedded memory (165,888 bits) in a 256-LBGA package. Built on the Cyclone II architecture, it integrates programmable logic, on-chip memory, and abundant I/O to support low-cost embedded processing and DSP-focused designs.

With 182 user I/Os, a single-core supply range of 1.15 V to 1.25 V, surface-mount 256-FBGA (17×17) packaging, and commercial grade operation from 0 °C to 85 °C, this device is suited for commercial embedded systems requiring configurable logic, memory, and flexible I/O connectivity.

Key Features

  • Programmable Logic Capacity — 8,256 logic elements provide the programmable fabric for implementing custom logic, control, and data-path functions.
  • Embedded Memory — Approximately 0.16 Mbits of on-chip RAM (165,888 bits) for local buffering, registers, and small memory structures.
  • I/O Resources — 182 user I/O pins support a wide range of interfaces and board-level connectivity needs.
  • Power and Voltage — Core supply range of 1.15 V to 1.25 V simplifies power planning and sequencing for the FPGA core.
  • Package and Mounting — 256-LBGA package; supplier device package noted as 256-FBGA (17×17); surface-mount mounting for standard SMT assembly.
  • Operating Range & Compliance — Commercial grade device rated for 0 °C to 85 °C and RoHS compliant for environmental regulatory requirements.
  • Cyclone II Architecture Features — Family-level features include global clock networks, PLL support, embedded multipliers and flexible embedded memory modes as described in the Cyclone II device handbook.

Typical Applications

  • Embedded Processing — Implement control logic, state machines, and soft-core processors for compact embedded systems leveraging the Cyclone II architecture.
  • Digital Signal Processing (DSP) — Support low-cost DSP functions using on-chip multipliers and local memory for filtering, accumulation, and intermediate buffering.
  • Memory Interface & Bridging — Act as a programmable interface or controller for external memory and peripheral bridging using available I/O and embedded resources.
  • Consumer & Commercial Electronics — Enable custom feature sets, I/O aggregation, and protocol adaptation in commercial devices within the 0 °C–85 °C operating window.

Unique Advantages

  • Compact Programmability: 8,256 logic elements and embedded RAM provide a balanced mix of logic and storage to reduce external component count.
  • Flexible I/O Count: 182 user I/Os allow integration of multiple interfaces and peripherals without needing additional bridge devices.
  • Recognized Architecture: Cyclone II family feature set (clocks, PLLs, multipliers, memory modes) provides design flexibility for embedded and DSP tasks.
  • Industry-Standard Packaging: 256-LBGA / 256-FBGA (17×17) footprint for mainstream surface-mount assembly and board-level density.
  • Commercial-Grade Operation: Rated for 0 °C to 85 °C to match typical commercial electronic product environments.
  • Regulatory Compliance: RoHS compliant to meet environmental requirements for electronics manufacturing.

Why Choose EP2C8F256C8?

The EP2C8F256C8 combines the Cyclone II family’s programmable architecture with a practical balance of logic density, embedded memory, and I/O resources—making it well suited for commercial embedded processing and DSP-oriented designs. Its single-core voltage range, standard BGA packaging, and RoHS compliance help streamline integration into established manufacturing flows.

Design teams seeking a configurable hardware platform for control, interface bridging, or signal-processing tasks will find the EP2C8F256C8 provides the necessary on-chip resources and family-level architecture features to accelerate development while keeping BOM complexity manageable.

Request a quote or submit a purchase inquiry to evaluate EP2C8F256C8 for your next embedded or DSP project.

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