EP2C8F256C7

The EP2C8F256C7 is a Cyclone II family FPGA providing a mid-density, low-cost programmable logic solution. It implements a Cyclone II architecture suited for embedded processing and DSP-oriented designs, offering a balance of logic capacity, on-chip memory and flexible I/O.

With 8,256 logic elements, approximately 0.166 Mbits of embedded memory and 182 I/O pins, this surface-mount device targets commercial applications that require compact package integration, low-voltage operation and RoHS compliance.

Key Features

• Logic Capacity  8,256 logic elements for implementing combinational and sequential logic in mid-density FPGA designs.
• Embedded Memory  Approximately 0.166 Mbits (165,888 bits) of on-chip RAM to support buffering, lookup tables and small memory blocks.
• I/O Density  182 I/O pins to enable broad external interfacing and peripheral connectivity for system integration.
• Power and Supply  Core voltage supply range of 1.15 V to 1.25 V for low-voltage operation.
• Package and Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) designed for surface-mount assembly in compact board layouts.
• Operating Range  Commercial-grade operating temperature range from 0 °C to 85 °C suitable for general-purpose electronics.
• Standards and Compliance  RoHS compliant to meet common environmental and regulatory requirements for commercial electronics.
• Cyclone II Family Capabilities  Built on the Cyclone II device architecture with family-level features such as global clock networks, PLL support, embedded multipliers and M4K memory resources (referenced in the Cyclone II Device Handbook).

Typical Applications

• Embedded Processing  Implement soft processors, control logic and glue functions in compact, cost-sensitive systems.
• Digital Signal Processing  Use the Cyclone II DSP-oriented architecture and embedded resources for moderate-rate signal processing tasks.
• Peripheral and Interface Bridging  Connect and translate between multiple on-board peripherals using the device’s 182 I/O pins for flexible I/O routing.
• Low-Cost System Integration  Integrate multiple system functions into a single programmable device to reduce BOM count in commercial products.

Unique Advantages

• Balanced Logic and Memory:  8,256 logic elements paired with approximately 0.166 Mbits of embedded RAM support both control and data-handling functions on one device.
• High I/O Count:  182 I/O pins enable broad connectivity without immediate need for external I/O expanders.
• Compact Surface-Mount Package:  256-LBGA / 256-FBGA (17×17) package integrates into dense PCB layouts while supporting automated assembly.
• Low-Voltage Core Operation:  1.15 V to 1.25 V supply range reduces core power while matching common FPGA power delivery schemes.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C for deployment in a wide range of commercial electronic products.
• RoHS Compliant:  Environmentally compliant manufacturing and materials for mainstream product lines.

Why Choose EP2C8F256C7?

The EP2C8F256C7 positions itself as a mid-density Cyclone II FPGA that combines a practical mix of logic resources, embedded memory and high I/O count in a compact 256-LBGA package. It is a suitable choice for designers building cost-sensitive commercial systems that need on-chip processing, DSP capability and flexible interfacing without moving to larger, higher-cost devices.

Backed by the Cyclone II device handbook and family-level architecture, this device is appropriate for teams seeking a reliable, standards-compliant FPGA building block that simplifies board-level integration and supports common commercial operating conditions.

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