EP2C8AF256I8NES

The EP2C8AF256I8NES is a Cyclone® II field programmable gate array (FPGA) from Intel. It provides 8,256 logic elements and on-chip embedded memory to implement custom digital logic in a compact, surface-mount 256‑LBGA package. Specified for industrial-grade operation and a low-voltage core supply, this device is suited for embedded designs that require programmable logic, moderate on-chip memory, and a high pin count in a small footprint.

Key Features

• Core Logic: 8,256 logic elements for implementing custom digital functions and finite-state machines.
• Embedded Memory: Approximately 0.16 Mbits of on-chip RAM (165,888 total bits) for FIFOs, buffers, and small data stores.
• I/O Count: 182 general-purpose I/O pins to support multiple interfaces and peripheral connections.
• Power Supply: Low-voltage core operation with a supply range of 1.15 V to 1.25 V to match platform power constraints.
• Package & Mounting: 256-LBGA package (supplier designation 256‑FBGA, 17×17) with surface-mount compatibility for compact PCB designs.
• Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance: RoHS‑compliant construction to meet environmental and manufacturing standards.

Typical Applications

• Embedded Control Systems: Implement custom control logic and state machines where a moderate logic count and on-chip RAM are required.
• Interface Bridging: Use the 182 I/Os to aggregate and convert between multiple peripheral or sensor interfaces on a single device.
• Prototyping and Development: Rapidly prototype digital designs that need reconfigurable logic and a compact package for evaluation boards or final products.

Unique Advantages

• Balanced Logic and Memory: 8,256 logic elements paired with approximately 0.16 Mbits of embedded RAM enable a range of mid‑complexity digital functions without external memory.
• High I/O Density: 182 I/O pins provide flexibility for multi‑interface designs and peripheral integration, reducing the need for external interface chips.
• Compact, Surface‑Mount Package: The 256‑LBGA (256‑FBGA, 17×17) package keeps board area low while supporting high pin counts for dense system designs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in industrial and other temperature‑challenging environments.
• Low‑Voltage Core: Core supply between 1.15 V and 1.25 V supports modern power architectures and can aid in overall system power management.
• Manufacturer Proven Family: Part of the Cyclone® II FPGA family from Intel, providing a known architecture and available technical documentation.

Why Choose EP2C8AF256I8NES?

The EP2C8AF256I8NES positions itself as a compact, industrial‑grade FPGA option with a balanced mix of logic capacity, on‑chip memory, and a high I/O count. Its low‑voltage core and surface‑mount 256‑LBGA package make it suitable for embedded designs where board space, power, and thermal range are key considerations.

This device is a practical choice for engineers and procurement teams seeking a reprogrammable logic solution for mid‑complexity applications, offering predictable electrical and thermal specifications and the supportability associated with Intel's Cyclone® II family.

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