EP2C70F896I8

The EP2C70F896I8 is an Intel Cyclone® II field-programmable gate array (FPGA) in an 896-ball BGA package designed for industrial applications. The device integrates a high-density logic fabric, substantial on-chip memory, and a large I/O count to support complex embedded, control and interface-centric designs.

Built around the Cyclone II architecture and documented in the Cyclone II Device Handbook, this device targets use cases that require logic capacity, embedded memory resources, and flexible I/O while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  Approximately 68,416 logic elements provide the programmable fabric needed for medium-to-high complexity designs and custom hardware acceleration.
• Embedded Memory  Approximately 1.15 Mbits of on-chip RAM (total RAM bits: 1,152,000) for FIFOs, buffering, and small data storage without external memory.
• High I/O Count  622 user I/O pins support extensive external connectivity and multi-channel interfaces for sensors, peripherals, and memory devices.
• Clocking and PLLs  Cyclone II architecture includes a global clock network and phase-locked loop (PLL) resources for flexible clocking and synchronous design topologies.
• Embedded DSP Resources  Dedicated embedded multipliers and DSP-friendly structures (as described in the Cyclone II documentation) support arithmetic and signal-processing functions.
• Advanced I/O Features  I/O structure supports differential interfaces, programmable drive strength, on-chip termination options and other I/O capabilities referenced in the device handbook.
• Power Supply Range  Core supply voltage range of 1.15 V to 1.25 V for defined power delivery and system integration.
• Package  896-BGA (supplier device package: 896-FBGA, 31×31 mm) for high-density board layouts.
• Industrial Grade Temperature  Operating temperature range from −40 °C to 100 °C for reliable operation in industrial environments.
• Standards and Configuration  Supported configuration and testing features such as JTAG boundary-scan are documented within the Cyclone II device handbook.

Typical Applications

• Embedded Control Systems  Custom control logic and interface bridging where high logic density and on-chip memory reduce external component count.
• Industrial Automation  Sensor aggregation, motor control front-ends, and deterministic I/O handling across the device’s industrial temperature range.
• Communications and Networking  Protocol bridging, packet processing, or interface conversion leveraging embedded multipliers and flexible clocking.
• Data Acquisition and Instrumentation  Multi-channel data capture and preprocessing using the device’s abundant I/O and embedded RAM for buffering.

Unique Advantages

• High logic density: 68,416 logic elements enable complex custom logic implementations without immediate need for higher-tier devices.
• Large I/O resource: 622 I/O pins simplify external connectivity and reduce the need for additional interface components.
• Integrated memory and DSP resources: Approximately 1.15 Mbits of embedded RAM and on-chip multipliers help contain BOM and improve system latency.
• Industrial temperature capability: Rated for −40 °C to 100 °C to meet the environmental needs of industrial deployments.
• Flexible clocking and timing: Global clock network and PLL support in the Cyclone II architecture enable robust synchronous system design.
• Compact, high-density package: 896-FBGA (31×31 mm) affords dense PCB routing for space-constrained applications.

Why Choose EP2C70F896I8?

The EP2C70F896I8 combines substantial logic capacity, significant on-chip RAM, a high I/O count, and Cyclone II architecture features such as PLLs and embedded multipliers—making it well suited for industrial and embedded designs that require mid-to-high complexity programmable logic. Its defined core voltage range and industrial operating temperature ensure predictable integration into long-lived systems.

Engineers specifying this FPGA benefit from documented Cyclone II device resources and architecture guidance, enabling scalable designs that leverage the device’s integration to reduce external components and simplify board-level design choices.

If you would like pricing or availability for EP2C70F896I8, request a quote or submit an inquiry to receive a formal quotation and technical support information.