EP2C70F896C7

The EP2C70F896C7 is a Cyclone II family FPGA offering high-density programmable logic in a compact 896-ball BGA package. It combines 68,416 logic elements with embedded memory and a broad I/O complement to address low-cost embedded processing and DSP-oriented designs.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.15 V to 1.25 V core supply and across a 0 °C to 85 °C temperature range, providing a balance of integration and predictable operating conditions for mainstream electronic systems.

Key Features

• High-density logic: 68,416 logic elements organized across 4,276 LABs to implement complex custom logic and control functions.
• Embedded memory: Approximately 1.15 Mbits of total on-chip RAM for data buffering, FIFOs, and state storage within the device.
• Extensive I/O: 622 general-purpose I/O pins to support wide parallel interfaces, dense sensor arrays, and multiple peripheral connections.
• Power and supply: Core voltage supply range of 1.15 V to 1.25 V to match system power rails and FPGA core requirements.
• Package and mounting: 896-BGA (supplier package: 896-FBGA, 31 × 31 mm) in a surface-mount form factor for compact board-level integration.
• Commercial operating range: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics deployments.
• Series-level features (Cyclone II): Architecture includes embedded multipliers, PLLs, a global clock network, flexible I/O standards, and external memory interfacing as documented in the Cyclone II device handbook.
• Compliance: RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Low-cost embedded processing: Implement custom control logic, soft processors, and glue logic where integration and cost-efficiency are primary concerns.
• Low-cost DSP solutions: Use embedded multipliers and on-chip RAM for signal-processing blocks such as filters and transforms in commercial products.
• High-density I/O systems: Support designs requiring large parallel interfaces—data acquisition, display controllers, or multi-channel sensor aggregation.
• Memory-interface designs: Integrate external memory interfaces using the device’s dedicated I/O structure and routing resources for buffering and external data access.

Unique Advantages

• High logic capacity: 68,416 logic elements enable larger designs without moving to a larger FPGA family, reducing PCB complexity.
• On-chip memory for system integration: Approximately 1.15 Mbits of embedded RAM reduces external memory dependence for many buffering and state-retention tasks.
• Very large I/O set: 622 I/O pins provide the flexibility to connect multiple peripherals, parallel buses, or wide data interfaces directly to the FPGA.
• Compact BGA package: 896-ball FBGA (31 × 31 mm) gives a high-pin-count solution in a space-efficient surface-mount footprint.
• Documented architecture: The Cyclone II device handbook documents architecture elements such as PLLs, embedded multipliers, and global clock networks to aid design and verification.
• RoHS compliant: Supports modern lead-free manufacturing and environmental compliance requirements.

Why Choose EP2C70F896C7?

The EP2C70F896C7 positions itself as a high-density, commercially rated Cyclone II FPGA that balances logic resources, on-chip memory, and a very large I/O count in a compact 896-BGA package. Its documented architecture and family-level features make it suitable for teams building cost-sensitive embedded processing and DSP-enabled systems that require substantial programmable logic and I/O capacity.

For design teams targeting commercial electronics, this device offers predictable operating limits, RoHS compliance, and architecture documentation to support implementation, verification, and integration into production designs.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2C70F896C7.