EP2C70F896C6N

The EP2C70F896C6N is a Cyclone II family FPGA offering a mid-to-large logic capacity in a high-density BGA package. It provides 68,416 logic elements, approximately 1.152 Mbits of embedded memory, and 622 I/O pins for flexible system integration.

Designed for low-cost embedded processing and DSP-oriented applications, this device combines substantial on-chip memory and DSP resources with a global clocking architecture and configurable I/O to address a range of embedded, interface, and signal-processing designs.

Key Features

• Logic Capacity — 68,416 logic elements provide significant programmable logic fabric for complex combinational and sequential designs.
• Logic Array Blocks — 4,276 logic array blocks (LABs) to organize and structure logic resources for efficient mapping and routing.
• Embedded Memory — Approximately 1.152 Mbits of on-chip RAM suitable for buffering, FIFOs, and small on-chip data stores.
• Rich I/O — 622 I/O pins enable high pin-count interfaces and extensive external connectivity.
• Clocking and DSP Support — Cyclone II family architecture includes a global clock network, PLLs, and embedded multipliers to support DSP and timing-critical functions (as documented in the Cyclone II device handbook).
• Package and Mounting — 896-ball BGA package (896-FBGA, 31 × 31 mm) in a surface-mount form factor for compact system placements.
• Power — Core supply voltage range of 1.15 V to 1.25 V for device operation.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Processing — Low-cost embedded systems that require substantial programmable logic and on-chip RAM for control, glue logic, or custom peripherals.
• Digital Signal Processing — DSP-focused designs that leverage the device’s embedded multipliers, on-chip memory, and global clocking for signal filtering, modulation, and processing tasks.
• High-Density I/O Interfaces — Systems requiring many external interfaces, protocol bridging, or custom I/O arrangements using 622 available I/O pins.
• Memory and Interface Controllers — Designs that implement external memory controllers or high-speed interfaces supported by Cyclone II architecture features documented in the device handbook.

Unique Advantages

• High programmable capacity: 68,416 logic elements enable integration of complex logic, reducing the need for multiple discrete devices.
• Substantial on-chip memory: Approximately 1.152 Mbits of embedded RAM supports buffering and local data storage to improve system throughput.
• Extensive I/O count: 622 I/Os provide flexibility for multi-channel interfaces, wide data buses, and diverse peripheral connections.
• Flexible clocking and DSP-friendly resources: Family-level support for PLLs, global clock networks, and embedded multipliers simplifies implementation of timing-sensitive and DSP functions.
• Compact BGA package: 896-ball FBGA (31 × 31 mm) allows high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose EP2C70F896C6N?

The EP2C70F896C6N balances substantial programmable logic and on-chip memory with a large I/O complement in a compact BGA package, making it well suited for designers building low-cost embedded processing and DSP-capable systems. Its Cyclone II family architecture and documented features—such as global clocking, PLLs, and embedded multipliers—support timing-critical and signal-processing applications while reducing external component count.

Backed by the Cyclone II device handbook and family documentation, this FPGA is appropriate for teams seeking a commercially graded, RoHS-compliant solution with a proven architectural feature set for a broad range of embedded and interface-focused designs.

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