EP2C70F896C8

The EP2C70F896C8 is a Cyclone® II field programmable gate array (FPGA) designed for commercial embedded and DSP-oriented applications. It integrates 68,416 logic elements, approximately 1.152 Mbits of on-chip RAM, and 622 user I/O pins to support complex control, processing, and interfacing tasks.

Engineered for compact, surface-mount implementations, this device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation from 0 °C to 85 °C. The device is RoHS compliant and supplied in an 896‑FBGA (31 × 31) package.

Key Features

• Core Logic Integrates 68,416 logic elements to implement complex digital logic and control functions.
• Embedded Memory Includes approximately 1.152 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• High I/O Count Provides 622 user I/O pins for broad external connectivity and parallel interfacing.
• Clocking & Timing Cyclone II architecture includes a global clock network and phase-locked loops (PLLs) to support flexible clock distribution and timing schemes.
• DSP & Arithmetic Support Architecture includes embedded multipliers and support structures suitable for digital signal processing and arithmetic acceleration.
• I/O Structure & Advanced Interfaces I/O architecture supports programmable drive strength, slew-rate control, onboard termination and a range of I/O standards for external memory and high-speed interfaces.
• Power Characteristics Core supply range of 1.15 V to 1.25 V allows deployment in modern low-voltage systems.
• Package & Mounting Available in an 896‑FBGA (31 × 31) surface-mount package (896‑BGA case) for space-efficient board designs.
• Commercial Grade & Environmental Rated for commercial temperature operation (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Embedded Processing Implement control and custom processing functions using the device’s dense logic and on-chip RAM.
• Digital Signal Processing (DSP) Use embedded multipliers and memory resources for low-cost DSP implementations and signal conditioning.
• High-Density I/O and Interface Bridging Leverage 622 I/O pins for parallel data paths, protocol bridging, and rich peripheral connectivity.
• External Memory Interfacing Deploy the I/O and timing features to interface with external memories and high-speed peripherals.

Unique Advantages

• High Logic Density: 68,416 logic elements enable substantial on-chip integration of custom logic and state machines, reducing external component count.
• Significant On-Chip Memory: Approximately 1.152 Mbits of embedded RAM supports buffering and complex data-handling tasks without immediate reliance on external memory.
• Extensive I/O Resources: 622 user I/Os provide flexibility for parallel interfaces, expandability, and complex board-level connectivity.
• Flexible Clocking and DSP Support: Integrated PLLs, global clock distribution, and embedded multipliers support a wide range of timing and signal-processing architectures.
• Compact, Surface-Mount Packaging: The 896‑FBGA (31 × 31) package enables dense board layouts while maintaining a high pin count.
• Commercial Qualification and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for general commercial applications.

Why Choose EP2C70F896C8?

The EP2C70F896C8 positions itself as a versatile Cyclone II FPGA choice when substantial logic capacity, significant embedded memory, and a large number of I/Os are required in a commercial-grade, surface-mount package. Its integrated clocking, DSP-oriented resources, and flexible I/O structure make it suitable for embedded processing, DSP acceleration, and high-density interface designs.

For projects that need a balance of logic density, onboard memory, and extensive connectivity within a compact 896‑FBGA footprint, the EP2C70F896C8 offers a straightforward path to consolidate functions and simplify board-level designs while remaining within commercial temperature and supply requirements.

Request a quote or submit an inquiry to check pricing and availability for the EP2C70F896C8 and to discuss how it fits your next design.