EP2C70F896C7N

The EP2C70F896C7N is a Cyclone® II field programmable gate array (FPGA) offered in a 896-ball BGA package for surface-mount assembly. It delivers a combination of high logic density, substantial on-chip memory, and a large I/O count suited to commercial embedded processing and DSP-focused designs.

Designed as part of the Cyclone II family, the device is documented in the Cyclone II Device Handbook and includes architecture-level features such as embedded memory, multipliers, and clocking resources to support configurable logic implementations in commercial electronic systems.

Key Features

• Core Logic 68,416 logic elements provide significant configurable logic capacity for complex glue logic, protocol bridging, and custom datapaths.
• Embedded Memory Approximately 1.15 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage for processing tasks.
• I/O Resources 622 user I/O pins enable broad connectivity for parallel buses, external memory interfaces, and mixed-signal front-ends.
• Clocking and Timing Family documentation details a global clock network and phase-locked loops (PLLs) to support flexible clock distribution and frequency synthesis.
• DSP Support The device family includes embedded multipliers and dedicated routing for arithmetic-intensive operations commonly used in DSP applications.
• Package & Mounting 896-FBGA (31×31 mm) package, surface-mount mounting type, suitable for compact board-level integration.
• Power and Operating Range Core supply voltage range 1.15 V to 1.25 V with an ambient operating temperature range of 0 °C to 85 °C (commercial grade).
• Compliance RoHS compliant.

Typical Applications

• Low-cost embedded processing — Implements custom control, protocol handling, and finite-state machines for commercial electronics as identified in Cyclone II documentation.
• DSP and signal processing — Uses embedded multipliers and on-chip RAM for algorithm acceleration and data buffering in real-time processing tasks.
• Memory interface bridging — Provides the logic and I/O resources needed for interfacing with external memory and peripherals.
• High-density I/O control — Supports systems requiring many parallel or multi-standard I/O connections such as display controllers, sensor arrays, or communication front-ends.

Unique Advantages

• High logic density: 68,416 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board area.
• Substantial embedded memory: Approximately 1.15 Mbits of on-chip RAM minimizes external memory dependence for many buffering and storage needs.
• Extensive I/O: 622 I/O pins provide design flexibility for large bus interfaces and mixed-signal connectivity.
• Flexible clocking: Integrated PLLs and global clock network support multiple clock domains and precise timing management.
• Commercial-grade, RoHS compliant: Suitable for commercial electronic product lifecycles with environmental compliance.
• Compact package: 896-FBGA (31×31) delivers dense integration for space-constrained PCB designs.

Why Choose EP2C70F896C7N?

The EP2C70F896C7N positions itself as a high-capacity Cyclone II FPGA option for commercial embedded and DSP applications that require large logic resources, ample on-chip memory, and extensive I/O. Its documented architecture—covering logic array blocks, embedded multipliers, memory modes, and clocking resources—supports flexible implementation of custom digital functions.

Backed by the Cyclone II Device Handbook and family-level documentation, this device is suitable for design teams seeking a commercially graded FPGA platform with verified architectural features, established design references, and the integration density needed to reduce system complexity.

Request a quote or submit an inquiry to evaluate EP2C70F896C7N for your next commercial FPGA design project.