EP2C70F672I8N

The EP2C70F672I8N is an Intel Cyclone® II family FPGA delivering a high-density, I/O-rich programmable logic fabric for embedded processing and DSP-focused designs. It combines 68,416 logic elements with approximately 1.15 Mbits of embedded memory and 422 I/O pins in a compact 672-ball BGA package, making it suitable for applications that require significant on-chip logic, RAM, and extensive external interfacing.

Designed for industrial-grade operation, this device supports surface-mount assembly, a supply voltage range of 1.15 V to 1.25 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity 68,416 logic elements to implement complex programmable logic and state machines.
• Embedded Memory Approximately 1.15 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Resources 422 general-purpose I/O pins to support wide external interfacing and multi-bank I/O architectures.
• Package & Mounting 672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact board designs.
• Power Supply Core supply specification of 1.15 V to 1.25 V.
• Thermal & Reliability Industrial operating temperature range from −40 °C to 100 °C for deployments in demanding environments.
• Standards & Compliance RoHS compliant.

Typical Applications

• Embedded Processing Implement custom control logic, state machines, and application-specific processors using the device’s large logic capacity and embedded RAM.
• Digital Signal Processing (DSP) Support low-cost DSP functions that benefit from on-chip memory and programmable logic resources.
• I/O-Intensive Systems Drive complex multi-interface boards and controllers that require many external connections thanks to 422 I/Os.
• Memory Interface and Bridge Logic Use embedded memory and abundant logic elements to handle external memory interfacing and protocol bridging.

Unique Advantages

• High Logic Density: 68,416 logic elements provide the capacity to consolidate multiple functions into a single device, reducing component count.
• Significant On-Chip RAM: Approximately 1.15 Mbits of embedded memory supports buffering and local data storage without external RAM.
• Extensive I/O Count: 422 I/Os enable broad connectivity for sensors, peripherals, and external memory interfaces.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact BGA Package: 672-ball FBGA (27×27) balances high pin count with a compact PCB footprint for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose EP2C70F672I8N?

The EP2C70F672I8N positions itself as a high-capacity, I/O-rich Cyclone II FPGA option for designers needing substantial on-chip logic and memory in a compact industrial-grade package. Its combination of 68,416 logic elements, approximately 1.15 Mbits of embedded RAM, and 422 I/Os makes it well suited to embedded processing, DSP tasks, and complex interface applications.

Documented in the Cyclone II device handbook, this device is a practical choice for development teams seeking a proven FPGA architecture with clear electrical and thermal specifications for system-level planning and integration.

If you would like pricing, availability, or a formal quote for EP2C70F672I8N, request a quote or submit an inquiry to begin the procurement process.