EP2C70F672C7N

The EP2C70F672C7N is a Cyclone II family FPGA providing a mid-range programmable logic solution with 68,416 logic elements and approximately 1.152 Mbits of embedded memory. Its architecture and documented Cyclone II features target low-cost embedded processing and DSP-focused designs while offering a broad complement of I/O and on-chip resources.

With 422 user I/O pins, a 672-ball FBGA surface-mount package, and a core supply range of 1.15 V to 1.25 V, this commercial-grade device is suited for applications that require substantial logic capacity, flexible I/O interfacing, and on-chip memory integration within a compact package and standard commercial temperature range (0 °C to 85 °C).

Key Features

• Logic Capacity  68,416 logic elements provide substantial programmable logic resource for combinational and sequential designs.
• Embedded Memory  Approximately 1.152 Mbits of on-chip RAM for data buffering, FIFOs, and embedded storage.
• Extensive I/O  422 user I/O pins support dense external interfacing and multiple I/O standards documented in the Cyclone II device handbook.
• Clocking and DSP Support  Device documentation details global clock networks, phase-locked loops (PLLs), and embedded multiplier resources for synchronous designs and DSP functions.
• Package & Mounting  672-FBGA (27×27) surface-mount package (672-BGA) for compact board-level integration.
• Power  Core voltage supply specified at 1.15 V to 1.25 V to meet Cyclone II core requirements.
• Operating Range & Grade  Commercial operating temperature range 0 °C to 85 °C; commercial grade device.
• Standards & Compliance  RoHS-compliant manufacturing.

Typical Applications

• Embedded Processing  Implement custom control logic, soft processors, and system glue logic using abundant logic elements and on-chip memory.
• DSP Acceleration  Use documented embedded multipliers and clocking resources for low-cost DSP tasks and signal-processing pipelines.
• High-Speed External Memory Interfaces  Take advantage of on-chip routing and I/O resources for external memory interfacing and data buffering.
• Multi-Interface Bridging  Leverage 422 I/O pins to consolidate multiple peripheral or bus interfaces in a single programmable device.

Unique Advantages

• High Logic Density: 68,416 logic elements enable sizeable programmable designs without moving to a larger device family.
• Substantial Embedded Memory: Approximately 1.152 Mbits of on-chip RAM reduces external memory needs for many mid-range applications.
• Broad I/O Count: 422 user I/O pins provide flexibility for complex interfacing and multi-channel designs.
• Flexible Clocking and DSP Resources: Documented global clock networks, PLLs, and embedded multipliers support synchronous designs and DSP workloads.
• Compact BGA Package: 672-FBGA (27×27) surface-mount package balances board area and pin count for dense system integration.
• Commercial-Grade Robustness: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for standard commercial applications.

Why Choose EP2C70F672C7N?

The EP2C70F672C7N positions itself as a Cyclone II-based solution for designers needing considerable programmable logic, embedded memory, and a high I/O count in a single, commercially graded FPGA. Its documented architecture—covering logic elements, embedded memory, clocking, and DSP-capable resources—makes it suitable for low-cost embedded processing and DSP-oriented projects that must remain within standard commercial temperature limits.

For teams focused on consolidating functionality, reducing external component count, and leveraging a well-documented device family, this part delivers a balance of integration, I/O flexibility, and on-chip resources backed by the Cyclone II device documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2C70F672C7N. Our team can provide configuration and procurement details to support your design timeline.