EP2C70F672C6N

The EP2C70F672C6N is an Intel Cyclone II FPGA in a 672-ball BGA package, providing a high-density programmable fabric for embedded and digital signal designs. It combines a large logic capacity with on-chip memory and extensive I/O to support applications that require flexible hardware implementation and complex interfacing.

Built on the Cyclone II architecture, this commercial‑grade device targets low-cost embedded processing and DSP-oriented solutions, offering documented architectural features such as global clock networks, PLLs, embedded multipliers, and memory blocks for system designers.

Key Features

• Programmable Fabric — 68,416 logic elements provide the programmable resources needed for complex custom logic and control functions.
• Embedded Memory — 1,152,000 bits of on‑chip RAM (approximately 1.15 Mbits) organized in M4K memory blocks to store data, FIFOs, and microcode locally.
• I/O Capacity & Standards — 422 I/O pins with support for advanced I/O standards and high‑speed differential interfaces to accommodate diverse external interfaces and memory connections.
• Clocking & DSP Resources — Integrated global clock network and phase‑locked loops (PLLs) plus embedded multipliers to support synchronous designs and DSP operations as described in the Cyclone II architecture.
• Configuration & Test — Device supports industry standard configuration and testing features including IEEE 1149.1 (JTAG) boundary scan and multiple configuration schemes.
• Package & Mounting — 672‑FBGA package (27 × 27 mm) in a surface‑mount form factor for compact board integration.
• Power & Operating Range — Core supply voltage range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for environmental safety and regulatory alignment.

Typical Applications

• Embedded Processing — Low‑cost embedded processing solutions that leverage the Cyclone II architecture for custom control, protocol handling, and system glue logic.
• Digital Signal Processing (DSP) — DSP‑oriented implementations that use the device’s embedded multipliers, on‑chip RAM, and PLLs for filtering, transforms, and acceleration tasks.
• High‑Speed I/O and Memory Interfaces — Designs requiring extensive I/O and advanced interface support for connecting external memory, sensors, or transceivers.
• Custom Logic and Prototyping — Hardware prototyping, custom peripherals, and application‑specific accelerators where reconfigurable logic and substantial resources are required.

Unique Advantages

• High Logic Density: 68,416 logic elements provide a large, flexible fabric for complex state machines, controllers, and custom datapaths.
• Substantial On‑Chip Memory: Approximately 1.15 Mbits of embedded RAM reduces external memory dependence and accelerates local data buffering and storage.
• Extensive I/O Capability: 422 I/O pins and support for differential and advanced I/O standards enable broad interfacing options without external glue components.
• Integrated Clocking and DSP Resources: Built‑in PLLs, a global clock network, and embedded multipliers simplify timing architectures and offload compute‑intensive signal tasks.
• Compact, Board‑Ready Package: 672‑FBGA (27 × 27 mm) surface‑mount package balances density and manufacturability for PCB integration.
• Commercial‑Grade and RoHS Compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and compliant with RoHS requirements.

Why Choose EP2C70F672C6N?

The EP2C70F672C6N delivers a balanced combination of logic capacity, on‑chip memory, and extensive I/O in a compact BGA package, suitable for designers requiring a programmable platform for embedded processing and DSP applications. Its Cyclone II architecture and documented device handbook provide the architectural features—clocking, memory modes, and I/O flexibility—needed to implement targeted, cost‑sensitive hardware solutions.

This device is well suited to engineering teams building scalable custom logic, high‑speed interfaces, or integrated signal‑processing blocks where a documented architecture and ample on‑chip resources improve time to prototype and reduce external component count.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2C70F672C6N.