EP2C70F672C7

The EP2C70F672C7 is an Intel Cyclone® II series FPGA designed for cost-sensitive embedded processing and DSP-focused applications. It implements the Cyclone II device architecture and offers a balance of logic capacity, on-chip memory, and I/O resources suitable for mid- to high-complexity designs.

This commercial-grade device provides 68,416 logic elements, approximately 1.152 Mbits of embedded memory, and 422 user I/O pins in a 672-ball BGA package, making it appropriate for designs that require significant programmable logic and extensive I/O in a compact surface-mount form factor.

Key Features

• Logic Capacity 68,416 logic elements provide substantial programmable resources for implementing complex control, processing, and glue-logic functions.
• Embedded Memory Approximately 1.152 Mbits of on-chip RAM for fast, tightly coupled storage in embedded and DSP designs.
• I/O Resources 422 user I/O pins to support broad interfacing needs, including multiple external memory and peripheral connections.
• Packaging & Mounting 672-ball BGA package (supplier device package: 672-FBGA, 27×27) with surface-mount mounting for compact board integration.
• Power Supply Core voltage range of 1.15 V to 1.25 V to match Cyclone II core requirements.
• Operating Temperature Commercial operating range of 0 °C to 85 °C for standard commercial applications.
• Cyclone II Architecture Features Device handbook references include global clock network and phase-locked loop (PLL) support, embedded multipliers, M4K embedded memory blocks, and multiple I/O standards and features for flexible design options.
• Standards & Compliance RoHS compliant for environmental and manufacturing compliance requirements.

Typical Applications

• Low-Cost Embedded Processing Use as a programmable compute element for controllers and embedded systems that require on-chip logic and memory.
• Low-Cost DSP Solutions Leverage the device’s embedded memory and multiplier resources for DSP tasks and signal processing pipelines.
• External Memory Interface High I/O count supports interfacing to external memory and peripherals for high-bandwidth data paths.
• Prototyping and Custom Hardware Acceleration Implement custom accelerators or prototype ASIC-bound logic using the Cyclone II architecture.

Unique Advantages

• High logic capacity: 68,416 logic elements enable implementation of complex finite-state machines, datapaths, and control logic without immediate off-chip resources.
• Substantial on-chip RAM: Approximately 1.152 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
• Extensive I/O: 422 user I/O pins provide ample connectivity for parallel buses, memory interfaces, and multiple peripheral domains.
• Compact, manufacturable package: 672-ball FBGA (27×27) surface-mount package balances pin count and board-area efficiency for production designs.
• Commercial temperature rating: 0 °C to 85 °C supports standard commercial deployments without industrial-grade qualification.
• RoHS compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose EP2C70F672C7?

The EP2C70F672C7 positions itself as a strong Cyclone II family member for designers needing a high number of logic elements, significant embedded memory, and broad I/O in a single, surface-mount FPGA package. Its combination of 68,416 logic elements, approximately 1.152 Mbits of on-chip RAM, and 422 I/Os supports a wide range of mid-range embedded and DSP applications while maintaining commercial-grade operating conditions.

This device is suited to engineering teams building cost-conscious, scalable hardware where on-chip resources and flexible Cyclone II architecture features—such as PLLs, embedded multipliers, and M4K memory blocks—help reduce external component count and simplify system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the EP2C70F672C7 and to discuss how it can fit your project requirements.