EP2C70F672I8

The EP2C70F672I8 is a Cyclone® II family FPGA from Intel (Altera) delivering a large logic fabric with 68,416 logic elements and approximately 1.152 Mbits of embedded RAM. Designed for industrial applications, the device provides a high I/O count and a flexible I/O architecture in a compact 672-ball BGA package.

Built on the Cyclone II architecture documented in the Cyclone II Device Handbook, this device targets embedded processing, DSP-oriented designs, and systems requiring extensive I/O and on-chip memory while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 68,416 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 1.152 Mbits of on-chip RAM suitable for buffers, FIFOs, and small memory structures.
• I/O Density — 422 user I/O pins to support large peripheral sets, parallel buses, and external memory interfaces.
• Clocking and DSP Support — Cyclone II family features documented in the device handbook include a structured global clock network and phase-locked loops (PLLs) for clock management and embedded multipliers for DSP operations.
• I/O Flexibility — Device documentation describes multi-volt I/O support, programmable drive strength, programmable pull-ups, bus-hold, and advanced I/O standard support for interfacing with diverse logic levels and high-speed differential interfaces.
• Package and Mounting — 672-BGA / 672-FBGA (27 × 27) surface-mount package for compact board integration.
• Power Supply — Core voltage specified between 1.15 V and 1.25 V for supply planning.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for industrial deployments.
• Standards and Documentation — Device family is covered in the Cyclone II Device Handbook and related Altera (Intel) documentation for configuration, timing, and system integration details.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Embedded Processing — Implement custom soft processors, peripheral controllers, and glue logic using the device’s large logic array and on-chip RAM.
• DSP and Signal Processing — Use embedded multipliers and on-chip memory for filtering, transforms, and other DSP tasks documented for the Cyclone II family.
• High-Density I/O Systems — Drive wide parallel interfaces, sensor arrays, or multiple peripheral buses with 422 I/O pins and programmable I/O features.
• External Memory Interfaces — Interface to external memories and high-speed buses leveraging the device’s dedicated I/O structure and external memory interfacing guidance in the handbook.

Unique Advantages

• High Logic Integration: 68,416 logic elements enable substantial on-chip functionality, reducing external glue logic and BOM complexity.
• Ample On-Chip Memory: Approximately 1.152 Mbits of embedded RAM supports buffering and local storage for deterministic, low-latency designs.
• Extensive I/O Reach: 422 I/O pins provide broad connectivity for complex systems, minimizing the need for external I/O expanders.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, suitable for demanding industrial environments.
• Flexible I/O and Clocking: Multi-volt I/O support, programmable drive characteristics, and documented PLL/global clock network options simplify interfacing and timing management.
• Regulatory and Environmental Compliance: RoHS compliance supports environmental and regulatory requirements for commercial and industrial products.

Why Choose EP2C70F672I8?

The EP2C70F672I8 offers a balance of large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade Cyclone II FPGA. It is well suited for engineers building embedded processing, DSP, and I/O-intensive systems that require a documented architecture and predictable operating characteristics.

Supported by the Cyclone II Device Handbook and Altera (Intel) documentation, the device provides the technical detail required for board-level integration, timing closure, and configuration planning while meeting RoHS requirements for compliance-minded designs.

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