EP2C70F672C8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA |
|---|---|
| Quantity | 22 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 422 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4276 | Number of Logic Elements/Cells | 68416 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1152000 |
Overview of EP2C70F672C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA
The EP2C70F672C8N is a Cyclone II family FPGA optimized for cost-sensitive embedded and DSP applications. It combines a substantial logic capacity with on-chip memory and a high I/O count to address a broad range of system and interface functions.
Built on the Cyclone II architecture, this device targets low-cost embedded processing and DSP solutions where integration, I/O density, and predictable supply/temperature operating ranges are important design criteria.
Key Features
- Logic Capacity 68,416 logic elements for implementing complex control, state machines, and data-path logic.
- Embedded Memory Approximately 1.152 Mbits of on-chip RAM suitable for data buffering, FIFOs, and small local memories.
- I/O Density 422 general-purpose I/O pins to support wide parallel interfaces, multiple peripherals, and board-level routing flexibility.
- Clocking & Timing Cyclone II architecture includes a global clock network and PLL support for flexible clock distribution and synchronization in multi-clock designs.
- DSP-Friendly Resources Cyclone II family documentation describes embedded multipliers and DSP-oriented features that aid arithmetic and signal processing implementations.
- Advanced I/O Support Architecture-level support for advanced I/O standards and high-speed differential interfaces to simplify external memory and serial interfaces.
- Power & Supply Core voltage supply range from 1.15 V to 1.25 V for the device core.
- Package & Mounting 672-ball BGA package (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact board designs.
- Commercial Temperature Grade Operating temperature range 0 °C to 85 °C, suitable for commercial applications.
- RoHS Compliant Environmentally compliant manufacturing and material status.
Typical Applications
- Embedded Control & Processing Use logic capacity and on-chip RAM to implement microcontroller substitutes, peripheral aggregation, and control engines in consumer and embedded products.
- Digital Signal Processing Leverage embedded multipliers and Cyclone II DSP features for audio, video, and low-to-mid-rate signal-processing tasks.
- Interface Bridging & Protocol Conversion High I/O count and advanced I/O standard support enable protocol adaptation between legacy and modern peripherals or buses.
- Prototyping & System Integration Large logic element count and flexible clocking support system-level prototyping and integration of multiple functions on a single device.
Unique Advantages
- High Logic Integration: 68,416 logic elements provide capacity to consolidate multiple functions and reduce system BOM.
- On-Chip Memory for Local Data Handling: Approximately 1.152 Mbits of embedded RAM lowers external memory needs for many buffering and control tasks.
- Extensive I/O Resources: 422 I/Os enable direct interfacing to a wide range of peripherals and parallel buses without immediate external multiplexing.
- Compact Package: 672-ball FBGA (27×27) delivers high density in a surface-mount footprint for space-constrained boards.
- Design Flexibility from Cyclone II Architecture: Global clock networks, PLLs, embedded multipliers, and advanced I/O features support varied application requirements.
- Regulatory and Manufacturing Readiness: RoHS compliance supports environmentally conscious manufacturing and supply chains.
Why Choose EP2C70F672C8N?
The EP2C70F672C8N positions itself as a cost-effective, high-capacity FPGA within the Cyclone II family for designers seeking significant on-chip logic, abundant I/O, and embedded memory in a compact BGA package. Its architecture supports common embedded and DSP-oriented workloads while fitting commercial temperature profiles and standard surface-mount manufacturing.
This device is appropriate for engineers and procurement teams building mid-range embedded systems, interface concentrators, or mixed-function prototypes that benefit from integrated logic, memory, and flexible I/O without moving to higher-cost device families.
Request a quote or submit a procurement inquiry to receive pricing and availability for EP2C70F672C8N and to discuss suitability for your project requirements.

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