EP2C70F672C8N

IC FPGA 422 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA

Quantity 22 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O422Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4276Number of Logic Elements/Cells68416
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1152000

Overview of EP2C70F672C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA

The EP2C70F672C8N is a Cyclone II family FPGA optimized for cost-sensitive embedded and DSP applications. It combines a substantial logic capacity with on-chip memory and a high I/O count to address a broad range of system and interface functions.

Built on the Cyclone II architecture, this device targets low-cost embedded processing and DSP solutions where integration, I/O density, and predictable supply/temperature operating ranges are important design criteria.

Key Features

  • Logic Capacity  68,416 logic elements for implementing complex control, state machines, and data-path logic.
  • Embedded Memory  Approximately 1.152 Mbits of on-chip RAM suitable for data buffering, FIFOs, and small local memories.
  • I/O Density  422 general-purpose I/O pins to support wide parallel interfaces, multiple peripherals, and board-level routing flexibility.
  • Clocking & Timing  Cyclone II architecture includes a global clock network and PLL support for flexible clock distribution and synchronization in multi-clock designs.
  • DSP-Friendly Resources  Cyclone II family documentation describes embedded multipliers and DSP-oriented features that aid arithmetic and signal processing implementations.
  • Advanced I/O Support  Architecture-level support for advanced I/O standards and high-speed differential interfaces to simplify external memory and serial interfaces.
  • Power & Supply  Core voltage supply range from 1.15 V to 1.25 V for the device core.
  • Package & Mounting  672-ball BGA package (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact board designs.
  • Commercial Temperature Grade  Operating temperature range 0 °C to 85 °C, suitable for commercial applications.
  • RoHS Compliant  Environmentally compliant manufacturing and material status.

Typical Applications

  • Embedded Control & Processing  Use logic capacity and on-chip RAM to implement microcontroller substitutes, peripheral aggregation, and control engines in consumer and embedded products.
  • Digital Signal Processing  Leverage embedded multipliers and Cyclone II DSP features for audio, video, and low-to-mid-rate signal-processing tasks.
  • Interface Bridging & Protocol Conversion  High I/O count and advanced I/O standard support enable protocol adaptation between legacy and modern peripherals or buses.
  • Prototyping & System Integration  Large logic element count and flexible clocking support system-level prototyping and integration of multiple functions on a single device.

Unique Advantages

  • High Logic Integration: 68,416 logic elements provide capacity to consolidate multiple functions and reduce system BOM.
  • On-Chip Memory for Local Data Handling: Approximately 1.152 Mbits of embedded RAM lowers external memory needs for many buffering and control tasks.
  • Extensive I/O Resources: 422 I/Os enable direct interfacing to a wide range of peripherals and parallel buses without immediate external multiplexing.
  • Compact Package: 672-ball FBGA (27×27) delivers high density in a surface-mount footprint for space-constrained boards.
  • Design Flexibility from Cyclone II Architecture: Global clock networks, PLLs, embedded multipliers, and advanced I/O features support varied application requirements.
  • Regulatory and Manufacturing Readiness: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose EP2C70F672C8N?

The EP2C70F672C8N positions itself as a cost-effective, high-capacity FPGA within the Cyclone II family for designers seeking significant on-chip logic, abundant I/O, and embedded memory in a compact BGA package. Its architecture supports common embedded and DSP-oriented workloads while fitting commercial temperature profiles and standard surface-mount manufacturing.

This device is appropriate for engineers and procurement teams building mid-range embedded systems, interface concentrators, or mixed-function prototypes that benefit from integrated logic, memory, and flexible I/O without moving to higher-cost device families.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP2C70F672C8N and to discuss suitability for your project requirements.

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