EP2C70F672C8

IC FPGA 422 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA

Quantity 22 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O422Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4276Number of Logic Elements/Cells68416
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1152000

Overview of EP2C70F672C8 – Cyclone® II Field Programmable Gate Array (FPGA) IC 422 1152000 68416 672-BGA

The EP2C70F672C8 is a Cyclone® II FPGA offering a high-density, low-voltage core for commercial embedded and DSP-focused designs. The device integrates 68,416 logic elements across 4,276 LABs, approximately 1.152 Mbits of on-chip RAM, and 422 I/O pins in a compact 672-ball FBGA (27 × 27) package.

This surface-mount, RoHS-compliant FPGA targets low-cost embedded processing and DSP applications where significant logic capacity, abundant I/O, and on-chip memory are required within a commercial temperature range (0 °C to 85 °C). Core supply operates between 1.15 V and 1.25 V.

Key Features

  • Core Logic — 68,416 logic elements implemented across 4,276 LABs provide substantial logic density for complex custom logic, control, and glue-logic functions.
  • Embedded Memory — Approximately 1.152 Mbits of on-chip RAM supports parallel buffering, FIFOs, and local data storage for high-throughput designs.
  • I/O Capacity — 422 I/O pins accommodate wide parallel buses, multiple interfaces, and extensive sensor or peripheral connectivity.
  • Package & Mounting — 672-ball FBGA (27 × 27) package, surface-mount mounting type, enabling compact board layouts and dense system integration.
  • Power — Low-voltage core operation from 1.15 V to 1.25 V for reduced core power consumption in system designs.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for consumer and many embedded applications.
  • Standards & Design Resources — Cyclone II device family documentation includes architecture and configuration details such as global clock networks, PLLs, embedded multipliers, and memory modes to aid system design and timing closure.
  • Environmental Compliance — RoHS-compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

  • Low-Cost Embedded Processing — Acts as a programmable system controller or glue logic for consumer and embedded platforms that benefit from reconfigurable hardware.
  • DSP-Oriented Designs — Suitable for low-cost DSP solutions that leverage on-chip memory and embedded multiplier/PLL architectures described in Cyclone II documentation.
  • High-Density I/O Interfaces — Ideal for applications requiring many parallel I/Os such as sensor arrays, display controllers, or multi-channel data acquisition front-ends.
  • Prototyping and Custom Logic — Provides substantial logic element count and on-chip resources for proof-of-concept, evaluation, and iterative hardware development.

Unique Advantages

  • High Logic Integration: 68,416 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
  • Significant On-Chip Memory: Approximately 1.152 Mbits of embedded RAM supports local buffering and data manipulation without external memory.
  • Extensive I/O Availability: 422 I/O pins provide flexibility for interfacing to parallel buses, multiple peripherals, or high-channel-count front ends.
  • Compact, Assembly-Friendly Package: 672-ball FBGA (27 × 27) delivers dense routing and compact PCB footprints for space-constrained systems.
  • Low-Voltage Operation: 1.15 V–1.25 V core supply supports lower power budgets and modern power architectures.
  • Documented Architecture: Cyclone II family documentation provides detailed information on clocking, embedded multipliers, memory modes, and configuration options to assist engineers during integration and optimization.

Why Choose EP2C70F672C8?

The EP2C70F672C8 combines substantial logic capacity, ample embedded memory, and large I/O count in a compact 672-ball FBGA package, making it a practical choice for commercial embedded and DSP-oriented projects that require reconfigurable hardware and board-level integration. Its documented Cyclone II architecture supports designers with detailed guidance on clocking, memory, and I/O strategies.

This device is well suited for teams building scalable, reprogrammable systems where consolidation of functions can simplify BOM, shorten development cycles, and provide long-term design flexibility supported by the Cyclone II documentation set.

Request a quote or submit a product inquiry to obtain pricing, lead-time, and availability information for the EP2C70F672C8.

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