EP2C70F672C6

The EP2C70F672C6 is a Cyclone® II field programmable gate array (FPGA) IC from Intel, designed for cost-sensitive embedded and DSP-focused applications. It provides a high logic capacity, substantial on-chip memory, and extensive I/O in a compact 672-ball BGA package for commercial-grade designs.

Built around the Cyclone II architecture and supported by the Cyclone II Device Handbook, this device targets low-cost embedded processing and digital signal processing solutions where logic density, memory, and flexible I/O are primary design drivers.

Key Features

• Logic Capacity — Approximately 68,416 logic elements, enabling complex digital designs and custom logic implementations.
• Embedded Memory — Approximately 1.152 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for processing tasks.
• Extensive I/O — 422 I/O pins to interface with peripherals, external memories, and high-density board-level routing.
• Package & Mounting — 672-ball BGA (672-FBGA, 27×27) surface-mount package for high-density PCB implementations.
• Power — Core supply range of 1.15 V to 1.25 V to match system power constraints.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C, suitable for standard commercial environments.
• Compliance — RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• Low-cost embedded processing — Implement embedded controllers and custom processing pipelines using the device’s logic density and on-chip RAM.
• Digital signal processing — Support DSP-focused functions that benefit from local memory and dense logic resources.
• High-density I/O systems — Drive multi-interface boards and external memory interfaces with 422 available I/O pins.
• Prototyping and commercial products — Use the commercial-grade Cyclone II device for proof-of-concept and volume designs in standard operating environments.

Unique Advantages

• High logic integration: Large count of logic elements allows consolidation of multiple functions into a single device, reducing system complexity.
• Substantial embedded memory: Approximately 1.152 Mbits of RAM on-chip minimizes external memory requirements for many designs.
• Broad I/O availability: 422 I/O pins support extensive peripheral and bus interfacing without immediate need for expanders.
• Compact BGA package: 672-FBGA (27×27) packaging delivers high pin density in a space-efficient footprint for PCB designs.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS-compliant for mainstream commercial deployments.
• Documented platform: Supported by Cyclone II device documentation for design, configuration, and integration guidance.

Why Choose EP2C70F672C6?

The EP2C70F672C6 combines high logic density, meaningful on-chip RAM, and extensive I/O in a compact BGA package, making it well suited for commercial embedded and DSP applications that require integration and flexible interfacing. Its electrical and thermal ratings—along with RoHS compliance and Cyclone II family documentation—provide a predictable platform for design and deployment.

This device is ideal for engineers and teams building cost-conscious systems that need substantial programmable logic and local memory while maintaining a compact board footprint and standard commercial operating temperature support.

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