EP2C70F896C6

The EP2C70F896C6 is a Cyclone® II field programmable gate array (FPGA) offered by Intel. It implements the Cyclone II architecture to deliver substantial on-chip logic capacity and a broad I/O complement for cost-sensitive embedded and DSP-oriented designs.

With 68,416 logic elements, approximately 1.15 Mbits of embedded memory and 622 I/O pins in a 896‑BGA (31×31) package, this device targets low-cost embedded processing and DSP applications where integration and predictable electrical characteristics matter.

Key Features

• Logic Capacity — 68,416 logic elements provide the programmable logic resources required for sizeable custom logic implementations.
• Embedded Memory — Approximately 1.15 Mbits of on-chip RAM to support buffering, lookup tables and intermediate data storage.
• I/O Resources — 622 user I/O pins for broad peripheral and bus interfacing options on a single device.
• Package & Mounting — 896‑BGA (31×31) supplier device package; surface-mount mounting for compact board integration.
• Power — Core voltage supply specification of 1.15 V to 1.25 V for the device core.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Cyclone II Architecture — Device handbook describes features such as global clock networks, phase‑locked loops (PLLs), embedded multipliers and block RAM (M4K) that form the underlying architecture.
• Design & Configuration Support — The Cyclone II Device Handbook and related documentation provide detailed architecture, timing and configuration guidance for system integration.

Typical Applications

• Low-cost embedded processing — Implement control logic, protocol handling and custom accelerators where integration reduces BOM and board area.
• Low-cost DSP solutions — Use embedded multipliers and on-chip memory to implement fixed- and floating-point signal-processing pipelines.
• High‑I/O peripheral aggregation — Consolidate multiple interfaces and sensor front-ends using the device’s 622 I/Os for flexible system partitioning.
• Memory interface and buffering — Leverage available embedded RAM and the Cyclone II external memory interfacing guidance for efficient data buffering and bus bridging.

Unique Advantages

• Substantial on-chip logic: 68,416 logic elements enable complex custom logic and moderate system integration on a single FPGA.
• Broad I/O count: 622 I/Os allow direct attachment of multiple peripherals and buses, reducing the need for external GPIO expanders.
• Integrated architectural building blocks: Cyclone II architecture documentation indicates support for PLLs, embedded multipliers and M4K memory blocks, simplifying common timing and DSP implementations.
• Compact BGA package: 896‑BGA (31×31) packaging supports high pin density in a space-efficient footprint for modern PCBs.
• Predictable electrical requirements: Well‑defined core supply range (1.15 V–1.25 V) helps with power-supply planning and thermal design within commercial operating limits.

Why Choose EP2C70F896C6?

The EP2C70F896C6 positions itself as a Cyclone II FPGA option for designers seeking a balance of logic capacity, embedded memory and high I/O density in a commercial‑grade device. Its specification set supports cost-sensitive embedded processing and DSP tasks while providing the architecture-level features described in the Cyclone II Device Handbook to aid implementation.

This device is suitable for teams needing a documented, architecture-driven FPGA platform with extensive I/O, substantial programmable logic and on-chip memory—enabling consolidated designs, reduced external components and straightforward integration into existing development flows.

Request a quote or submit an inquiry to receive pricing and availability for EP2C70F896C6 and to discuss how this Cyclone® II FPGA can fit your design requirements.