EP2C70F896C8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 622 1152000 68416 896-BGA |
|---|---|
| Quantity | 487 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 622 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4276 | Number of Logic Elements/Cells | 68416 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1152000 |
Overview of EP2C70F896C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 622 1152000 68416 896-BGA
The EP2C70F896C8N is an Intel Cyclone II FPGA delivering a large logic fabric and substantial on-chip memory for cost-sensitive embedded and DSP applications. It combines 68,416 logic elements (4,276 LABs) with approximately 1.15 Mbits of embedded memory and 622 I/O to address complex glue-logic, interface, and processing tasks.
Designed for commercial-grade systems, this surface-mount 896-FBGA (31×31) device operates from a core supply of 1.15 V to 1.25 V and across a 0 °C to 85 °C temperature range, with RoHS-compliant manufacturing.
Key Features
- Logic Capacity 68,416 logic elements (4,276 LABs) provide ample programmable logic for mid-density FPGA designs and complex finite-state, control and data-path implementations.
- Embedded Memory Approximately 1.15 Mbits of total on-chip RAM (1,152,000 bits) for FIFOs, buffers, and local data storage.
- I/O Resources 622 I/O pins support broad interfacing needs; device documentation details advanced I/O standard support, programmable drive strengths, and high-speed differential options.
- DSP and Arithmetic Support Cyclone II architecture includes embedded multipliers and DSP-oriented resources suitable for low-cost signal processing tasks.
- Clocking and Timing Dedicated global clock network and Phase-Locked Loops (PLLs) provide flexible clock distribution and frequency synthesis for synchronous designs.
- Package and Mounting 896-FBGA package (31×31) in an industry-standard BGA footprint; surface-mount mounting type for PCB integration.
- Power and Environmental Core supply voltage range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C; RoHS-compliant.
- Configuration & Test Device documentation includes configuration options and IEEE 1149.1 (JTAG) boundary-scan support for programming and board-level testing.
Typical Applications
- Low-Cost Embedded Processing Use the logic and on-chip memory for embedded control, protocol handling, and system glue logic in commercial electronics.
- DSP and Signal Processing Leverage embedded multipliers and the Cyclone II architecture for cost-sensitive digital signal processing tasks.
- High-Density I/O Bridging 622 I/O pins enable complex interface conversion, protocol bridging, and multi-domain signal aggregation.
- Memory and Interface Controllers On-chip RAM and dedicated routing resources support memory interfacing, buffering, and external memory controller logic.
Unique Advantages
- Substantial Logic Fabric: Provides 68,416 logic elements to implement complex logic, state machines, and custom accelerators without immediate need for higher-density devices.
- Integrated On-Chip Memory: Approximately 1.15 Mbits of embedded RAM reduces external memory requirements for many designs, simplifying board-level BOMs.
- High I/O Count: 622 I/O pins offer flexibility for multi-channel interfaces and extensive peripheral connectivity on a single device.
- DSP-Oriented Resources: Embedded multipliers and DSP-friendly routing enable efficient implementation of arithmetic and filtering functions.
- Documented Architecture and Tooling: Backed by Cyclone II device documentation covering clocking, configuration, and I/O standards to accelerate development and verification.
- Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with RoHS-compliant construction for mainstream commercial applications.
Why Choose EP2C70F896C8N?
The EP2C70F896C8N positions itself as a capable mid-density Cyclone II FPGA suited for cost-conscious embedded and DSP applications that require substantial logic, memory, and I/O in a single surface-mount package. Its combination of 68,416 logic elements, approximately 1.15 Mbits of on-chip RAM, and 622 I/O pins supports complex interfacing and processing tasks while keeping system integration straightforward.
With architecture-level features such as PLLs, embedded multipliers, and a documented global clock network, the device is appropriate for designers seeking a balance of integration and documented design guidance from the Cyclone II device family.
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