EP2C70F896C8N

IC FPGA 622 I/O 896FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 622 1152000 68416 896-BGA

Quantity 487 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O622Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4276Number of Logic Elements/Cells68416
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1152000

Overview of EP2C70F896C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 622 1152000 68416 896-BGA

The EP2C70F896C8N is an Intel Cyclone II FPGA delivering a large logic fabric and substantial on-chip memory for cost-sensitive embedded and DSP applications. It combines 68,416 logic elements (4,276 LABs) with approximately 1.15 Mbits of embedded memory and 622 I/O to address complex glue-logic, interface, and processing tasks.

Designed for commercial-grade systems, this surface-mount 896-FBGA (31×31) device operates from a core supply of 1.15 V to 1.25 V and across a 0 °C to 85 °C temperature range, with RoHS-compliant manufacturing.

Key Features

  • Logic Capacity  68,416 logic elements (4,276 LABs) provide ample programmable logic for mid-density FPGA designs and complex finite-state, control and data-path implementations.
  • Embedded Memory  Approximately 1.15 Mbits of total on-chip RAM (1,152,000 bits) for FIFOs, buffers, and local data storage.
  • I/O Resources  622 I/O pins support broad interfacing needs; device documentation details advanced I/O standard support, programmable drive strengths, and high-speed differential options.
  • DSP and Arithmetic Support  Cyclone II architecture includes embedded multipliers and DSP-oriented resources suitable for low-cost signal processing tasks.
  • Clocking and Timing  Dedicated global clock network and Phase-Locked Loops (PLLs) provide flexible clock distribution and frequency synthesis for synchronous designs.
  • Package and Mounting  896-FBGA package (31×31) in an industry-standard BGA footprint; surface-mount mounting type for PCB integration.
  • Power and Environmental  Core supply voltage range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C; RoHS-compliant.
  • Configuration & Test  Device documentation includes configuration options and IEEE 1149.1 (JTAG) boundary-scan support for programming and board-level testing.

Typical Applications

  • Low-Cost Embedded Processing  Use the logic and on-chip memory for embedded control, protocol handling, and system glue logic in commercial electronics.
  • DSP and Signal Processing  Leverage embedded multipliers and the Cyclone II architecture for cost-sensitive digital signal processing tasks.
  • High-Density I/O Bridging  622 I/O pins enable complex interface conversion, protocol bridging, and multi-domain signal aggregation.
  • Memory and Interface Controllers  On-chip RAM and dedicated routing resources support memory interfacing, buffering, and external memory controller logic.

Unique Advantages

  • Substantial Logic Fabric: Provides 68,416 logic elements to implement complex logic, state machines, and custom accelerators without immediate need for higher-density devices.
  • Integrated On-Chip Memory: Approximately 1.15 Mbits of embedded RAM reduces external memory requirements for many designs, simplifying board-level BOMs.
  • High I/O Count: 622 I/O pins offer flexibility for multi-channel interfaces and extensive peripheral connectivity on a single device.
  • DSP-Oriented Resources: Embedded multipliers and DSP-friendly routing enable efficient implementation of arithmetic and filtering functions.
  • Documented Architecture and Tooling: Backed by Cyclone II device documentation covering clocking, configuration, and I/O standards to accelerate development and verification.
  • Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with RoHS-compliant construction for mainstream commercial applications.

Why Choose EP2C70F896C8N?

The EP2C70F896C8N positions itself as a capable mid-density Cyclone II FPGA suited for cost-conscious embedded and DSP applications that require substantial logic, memory, and I/O in a single surface-mount package. Its combination of 68,416 logic elements, approximately 1.15 Mbits of on-chip RAM, and 622 I/O pins supports complex interfacing and processing tasks while keeping system integration straightforward.

With architecture-level features such as PLLs, embedded multipliers, and a documented global clock network, the device is appropriate for designers seeking a balance of integration and documented design guidance from the Cyclone II device family.

Request a quote or submit an inquiry to receive pricing, availability, and further technical assistance for EP2C70F896C8N.

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