EP2C8AF256I8N

The EP2C8AF256I8N is an Intel Cyclone® II field-programmable gate array (FPGA) provided in a 256-ball BGA package for surface-mount assembly. It delivers configurable logic capacity and on-chip memory with a power supply range suited to core FPGA operation.

Designed and specified for industrial-grade operation, this device targets applications that require moderate logic density, flexible I/O count, and extended temperature capability for reliable deployment in demanding environments.

Key Features

• Logic Capacity — 8,256 logic elements to implement combinational and sequential logic for mid-density designs.
• Embedded Memory — 165,888 bits of on-chip RAM, approximately 0.166 Mbits of embedded memory for buffering, FIFOs, and small data structures.
• I/O Count — 182 general-purpose I/O pins, enabling broad external connectivity for peripherals, sensors, and bus interfaces.
• Power Supply — Operates from a core supply range of 1.15 V to 1.25 V, matching standard FPGA core voltage requirements.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FBGA, 17×17) with surface-mount mounting for compact PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory Status — RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control & Automation — Use the device’s logic capacity and extended temperature range for control, sequencing, and interface glue logic in industrial equipment.
• Instrumentation & Measurement — Implement data-handling, custom timing, and buffering with the on-chip RAM and abundant I/O for sensors and acquisition modules.
• Embedded Prototyping — Deploy as a development platform for mid-density FPGA designs that require reprogrammable logic and flexible I/O.
• Communications & Interface Bridging — Leverage 182 I/Os to create protocol bridges, parallel interfaces, and custom peripheral controllers.

Unique Advantages

• Balanced Logic and Memory — 8,256 logic elements combined with approximately 0.166 Mbits of embedded RAM provide a balanced resource set for mid-range FPGA designs.
• Generous I/O Availability — 182 I/O pins support extensive external connectivity without adding complex multiplexing schemes.
• Industrial-Grade Operation — Specified for −40 °C to 100 °C operation, enabling deployment in industrial and temperature-challenged applications.
• Compact BGA Packaging — 256-ball BGA (17×17 FBGA footprint) allows high-density PCB layouts while maintaining reliable surface-mount assembly.
• RoHS-Compliant — Meets lead-free environmental requirements for modern manufacturing processes.

Why Choose EP2C8AF256I8N?

The EP2C8AF256I8N positions itself as a practical choice for engineers seeking a mid-density Cyclone II FPGA with a solid mix of logic, embedded memory, and I/O resources in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require robust environmental tolerance and modern assembly practices.

This device is well suited to customers building control systems, instrumentation, interface bridges, or development platforms that need reconfigurable logic, moderate on-chip memory, and extensive I/O without moving to larger, higher-cost FPGA families.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for EP2C8AF256I8N. Our team can provide ordering details and support for integrating this FPGA into your design cycle.