EP2C8AF256A7N

The EP2C8AF256A7N is a Cyclone® II family FPGA delivering 8,256 logic elements, approximately 0.166 Mbits of embedded memory, and 182 I/O pins in a 256-ball BGA package. It implements the Cyclone II architecture targeted at cost-sensitive embedded processing and DSP-oriented designs while providing a compact, high-integration programmable device.

Designed and qualified for automotive applications with AEC-Q100 certification, this device supports a 1.15 V to 1.25 V core supply and an extended operating range from −40°C to 125°C for robust operation in demanding environments.

Key Features

• Core Logic  8,256 logic elements provide programmable logic resources for control, glue logic, and custom processing functions.
• Embedded Memory  Approximately 0.166 Mbits (165,888 bits) of on-chip RAM for data buffering, FIFOs, and small embedded storage.
• I/O Capability  182 user I/O pins enable broad interfacing to peripherals, sensors, and external memory devices.
• Package  256-ball BGA package (supplier device package listed as 256-FBGA (17×17)) for compact board-level integration and reliable soldered connections.
• Power  Core voltage range of 1.15 V to 1.25 V to match Cyclone II power domains and support predictable power planning.
• Temperature & Qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for deployment in temperature-extreme environments.
• Clocking & DSP Support  Cyclone II architecture includes dedicated clock networks and PLL support plus embedded multiplier and DSP routing features described in the device handbook.
• I/O Features  I/O structure and advanced I/O standard support such as programmable drive strength, slew-rate control, and differential interfaces are documented in the Cyclone II handbook.

Typical Applications

• Automotive Control Systems  Suitable for control and interfacing tasks in automotive electronics where AEC-Q100 qualification and extended temperature operation are required.
• Embedded Processing  Custom embedded controllers, protocol handling, and glue logic where a moderate density of logic elements and on-chip memory optimize system integration.
• Low-Cost DSP Functions  Signal processing tasks that leverage Cyclone II’s embedded multipliers and routing for cost-efficient DSP implementations.
• Interface Bridging  High-pin-count I/O support for bridging between sensors, peripherals, and external memory or buses in compact system designs.

Unique Advantages

• Automotive-Qualified Device:  AEC-Q100 qualification and automotive grade designation provide a suitable baseline for automotive system integration and reliability planning.
• Compact, High-Integration Package:  256-ball BGA (256-FBGA (17×17)) enables dense board integration while delivering a substantial I/O count for peripheral connectivity.
• Balanced Logic and Memory:  8,256 logic elements combined with approximately 0.166 Mbits of embedded RAM support a wide range of control and buffering needs without external SRAM for many designs.
• Robust Operating Range:  Core supply of 1.15–1.25 V and −40°C to 125°C operating temperature support deployment in thermally challenging environments.
• Architectural Features from Cyclone II Family:  Documented support for dedicated clock networks, PLLs, embedded multipliers, and flexible I/O options enables practical implementation of timing-critical and mixed-signal interfacing designs.

Why Choose EP2C8AF256A7N?

The EP2C8AF256A7N positions itself as a compact, automotive-qualified Cyclone II FPGA suitable for embedded control, DSP, and interface applications that require a balance of logic density, on-chip RAM, and a high I/O count. Its AEC-Q100 qualification and extended temperature range make it appropriate for designs where environmental robustness is a priority.

For engineers seeking a vendor-documented Cyclone II solution with clear architectural guidance (clocking, memory, DSP blocks, and I/O features), this device offers predictable integration and reliable operation within the specified voltage and temperature envelopes.

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