EP2C8F256C6

The EP2C8F256C6 is a Cyclone® II family Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a balanced combination of logic capacity, embedded memory, and flexible I/O in a compact 256-LBGA package for commercial-grade embedded and signal-processing designs.

Designed for cost-conscious applications, this device provides on-chip memory and architectural features from the Cyclone II series to support embedded processing, DSP-oriented tasks, and advanced I/O interfacing while operating within a commercial temperature range.

Key Features

• Logic Capacity — 8,256 logic elements to implement combinational and sequential logic for control, glue logic, and mid-density FPGA functions.
• Embedded Memory — Approximately 0.16 Mbits of total on-chip RAM (165,888 bits) for FIFOs, buffering, and small data stores.
• I/O Count & Flexibility — 182 user I/O pins with Cyclone II family I/O features such as programmable drive strength, slew-rate control, bus-hold, and support for a variety of I/O standards and differential interfaces.
• Clocking & DSP Support — Family-level architecture includes a global clock network and phase-locked loops (PLLs), plus embedded multiplier resources to support DSP and arithmetic operations.
• Package & Mounting — 256-LBGA surface-mount package (supplier package listed as 256-FBGA, 17×17) for compact board integration.
• Power & Operating Range — Core supply range of 1.15 V to 1.25 V and commercial operating temperature range of 0°C to 85°C.
• Configuration & Test — Cyclone II family supports standard configuration and IEEE 1149.1 (JTAG) boundary-scan features for programming and test access.
• Compliance — RoHS-compliant device suitable for commercial product assemblies.

Typical Applications

• Embedded Processing — Implement soft processors, control logic, and peripheral interfaces where integrated logic and memory enable compact system designs.
• Low-Cost DSP — Perform fixed-point arithmetic, filtering, and signal pre-processing using on-chip multipliers and embedded memory for buffering.
• High-Density I/O Bridging — Manage parallel interfaces, protocol bridging, and I/O expansion across 182 I/O pins with configurable drive and signaling options.
• External Memory Interfacing — Support external memory controllers and interface logic using the device’s I/O features and family routing architecture.

Unique Advantages

• Mid-Density Logic in a Compact Footprint: 8,256 logic elements packaged in a 256-LBGA provide room for substantial logic without large board area.
• Integrated On-Chip Memory: Approximately 0.16 Mbits of RAM reduces external memory needs for many control and buffering tasks.
• Versatile I/O Capabilities: 182 I/Os with programmable drive, slew-rate control, and support for differential interfaces ease board-level signal integration.
• Family-Level Clocking & DSP Resources: Global clock network, PLLs, and embedded multipliers enable deterministic timing and signal-processing functions.
• Commercial Temperature and RoHS Compliance: Suited for mainstream commercial applications with environmental compliance for modern assemblies.
• Documentation and Design Resources: Backed by Cyclone II device documentation and device handbook for design, configuration, and testing guidance.

Why Choose EP2C8F256C6?

The EP2C8F256C6 positions as a practical Cyclone II FPGA option for designers who need a balanced mix of logic elements, embedded memory, and flexible I/O in a compact, RoHS-compliant 256-LBGA package. Its combination of 8,256 logic elements, embedded RAM, and family-level clocking and DSP features makes it suitable for embedded processing, DSP tasks, and I/O-centric applications in commercial products.

This device is appropriate for development teams and OEMs seeking predictable performance within a 0°C to 85°C operating range, supported by Cyclone II series documentation and configuration/test capabilities such as JTAG boundary scan.

Request a quote or submit a purchasing inquiry to receive pricing and availability for EP2C8F256C6. Our team can provide lead-time details and ordering information to support your design milestones.