EP2C8F256I8

The EP2C8F256I8 is a Cyclone® II FPGA packaged in a 256-pin BGA, offering reprogrammable logic with 8,256 logic elements and approximately 0.166 Mbits of embedded memory (165,888 total RAM bits). Designed for surface-mount applications, the device provides 182 user I/O and operates from a core supply of 1.15 V to 1.25 V.

Targeted at industrial applications, this FPGA combines a compact 256-pin package and an extended operating temperature range (−40 °C to 100 °C) to support embedded processing and DSP-oriented designs within the Cyclone II device family documentation and tooling.

Key Features

• Logic Capacity 8,256 logic elements and 516 logic array blocks, enabling a broad set of programmable logic implementations.
• Embedded Memory Approximately 0.166 Mbits (165,888 bits) of on-chip RAM for small to moderate storage and buffering requirements.
• I/O Resources 182 user I/O pins to support multiple interfaces and peripheral connections in a single device.
• Package and Mounting 256-LBGA package (supplier package referenced as 256-FBGA, 17×17) optimized for surface-mount assembly and compact board layouts.
• Power Core supply voltage range of 1.15 V to 1.25 V to match Cyclone II family power requirements.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial environment demands.
• Standards & Documentation Part of the Cyclone II family with supporting device handbook and configuration/testing information provided in the Cyclone II Device Handbook.
• RoHS Compliant Conforms to RoHS environmental requirements.

Typical Applications

• Low-Cost Embedded Processing Implement compact embedded processors and custom logic functions within constrained board space using the built-in logic and on-chip RAM.
• Low-Cost DSP Solutions Deploy signal processing functions that benefit from reprogrammable logic and the Cyclone II architecture’s DSP-oriented resources.
• Industrial Control Use the industrial temperature rating and robust I/O count for control, monitoring, and interface tasks in industrial equipment.

Unique Advantages

• High-density programmable logic: 8,256 logic elements and 516 logic array blocks provide ample capacity for mid-range logic designs.
• Integrated on-chip RAM: Approximately 0.166 Mbits of embedded memory reduces external memory requirements for buffering and small data storage.
• Generous I/O count: 182 I/O pins allow flexible interfacing with peripherals and external devices without adding expansion hardware.
• Industrial thermal range: Rated −40 °C to 100 °C to support deployments in harsh or variable-temperature environments.
• Compact BGA footprint: 256-ball BGA (supplier 256-FBGA, 17×17) supports high-density PCB designs and reliable surface-mount assembly.
• Low-voltage core operation: 1.15 V to 1.25 V supply range suitable for Cyclone II family power architectures.

Why Choose EP2C8F256I8?

The EP2C8F256I8 delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 256-pin BGA package, making it well suited for mid-range programmable logic tasks in industrial and embedded environments. Its specification set aligns with designs that require moderate logic density, on-chip RAM, and a higher I/O count within a surface-mount form factor.

Backed by Cyclone II family documentation from the manufacturer, this device is appropriate for engineers seeking a documented, industrial-temperature FPGA option that integrates core logic, memory, and I/O in a single package.

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