EP2C8Q208C7

The EP2C8Q208C7 is a Cyclone® II family field programmable gate array (FPGA) in a 208-BFQFP surface-mount package. It provides 8,256 logic elements, approximately 0.166 Mbits of embedded memory, and 138 general-purpose I/O pins in a compact 28 × 28 mm package, targeting commercial-grade embedded processing and DSP-focused applications.

Designed around the Cyclone II architecture, this device combines a low-voltage core (1.15–1.25 V) with device-level features documented in the Cyclone II Device Handbook such as clock management, embedded multipliers, and on-chip memory to support cost-sensitive, space-constrained designs.

Key Features

• Logic Capacity  8,256 logic elements for implementing custom digital functions and mid-density logic designs.
• Embedded Memory  Approximately 0.166 Mbits of on-chip RAM to support buffering, frame storage, and small-data FIFOs.
• I/O Resources  138 I/O pins suitable for a broad set of peripheral interfaces and signal routing in board-level designs.
• Voltage Supply  Core voltage range of 1.15 V to 1.25 V for the Cyclone II core domain.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) surface-mount package for compact PCB layouts.
• Operating Temperature  Commercial temperature grade: 0 °C to 85 °C for typical commercial-environment deployments.
• Standards & Compliance  RoHS compliant to meet environmental and manufacturing lead-free requirements.
• Cyclone II Architecture Features  Architecture-level capabilities documented in the Cyclone II Device Handbook include phase-locked loops (PLLs), embedded multipliers, flexible clock networks, and M4K memory blocks to support synchronous designs and DSP tasks.

Typical Applications

• Embedded Processing  Implement soft processors, glue logic, and protocol bridging using the device’s logic capacity and on-chip memory.
• Low-Cost DSP Functions  Utilize the Cyclone II architecture’s embedded multipliers and memory for basic DSP pipelines and signal conditioning.
• Memory Interfacing  Integrate external memory interfaces and buffering schemes leveraging the device’s I/O resources and embedded RAM.
• Custom Logic for Consumer Electronics  Add application-specific control, user interfaces, and peripheral aggregation in commercial-grade products operating within 0 °C to 85 °C.

Unique Advantages

• Balanced Logic Density: 8,256 logic elements provide a mid-range resource set suitable for control, processing, and glue-logic functions without unnecessary overhead.
• Compact Packaging: The 208-BFQFP (28 × 28 mm) surface-mount package enables dense PCB placement while providing a high I/O count.
• Flexible I/O Count: 138 I/O pins support multiple interfaces and simplify board-level integration with peripherals and memory devices.
• Low-Voltage Core: Core operation at 1.15–1.25 V supports power-efficient designs when paired with appropriate board-level power supplies.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet requirements for a wide range of commercial electronic products.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for global supply chains.

Why Choose EP2C8Q208C7?

The EP2C8Q208C7 positions itself as a mid-density Cyclone II FPGA option for designers who need a practical mix of logic, embedded memory, and a high I/O count in a compact surface-mount package. Its Cyclone II family architecture—documented in the device handbook—provides architectural building blocks such as PLLs, embedded multipliers, and on-chip M4K memory that help implement embedded processing and DSP-oriented functions.

This part is suitable for commercial-grade designs that require moderate logic resources, flexible I/O, and a compact board footprint. The combination of RoHS compliance, documented Cyclone II capabilities, and a well-defined operating voltage and temperature range supports reliable integration into production products and long-term design planning.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering details for EP2C8Q208C7.